Optical Semiconductor Package Turning Mirror Integration
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Solution Overview
Problem
Fabricating and aligning turning mirrors in semiconductor devices with photonic dies attached to substrates is challenging, leading to difficulties in routing optical signals effectively.
Innovation Solution
The use of direct silicon and oxygen bonding between the glass turning mirror base and the photonic die, along with a gas-filled space and anti-reflective coatings, minimizes signal disruption and enhances beam interaction quality by eliminating intervening layers and optimizing the index of refraction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If turning mirrors are used to route optical signals, then optical signal routing is achieved, but fabrication and alignment difficulty increases
Solution Approach 1:
The patent combines the turning mirror with the photonic die into an integrated structure where the mirror is formed directly on the die surface. This integration eliminates the need for separate mirror components and their associated alignment procedures, directly addressing the fabrication and alignment difficulty while maintaining optical signal transmission reliability.
Solution Approach 2:
The patent introduces an intermediary layer with a specific index of refraction between the photonic die and the external optical environment. This intermediary layer optimizes optical coupling and reduces signal disruption, thereby maintaining reliability while simplifying the overall structure and reducing alignment requirements.
2Ease of manufacture
If intervening layers are present between photonic die and turning mirror, then fabrication is simplified, but signal disruption and noise increase
Solution Approach 1:
The patent optimizes the index of refraction parameter of the intermediary layer to match or optimize optical coupling between the photonic die and the external environment. By carefully selecting and controlling this parameter, the patent minimizes signal disruption and noise while maintaining fabrication simplicity through the use of standard semiconductor manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in lower noise and higher quality optical signal transmission by reducing signal degradation and improving the alignment and fabrication of turning mirrors within semiconductor devices.
Implementation Method 1
optimizing the index of refraction
Implementation Method 2
anti-reflective coatings
Data Source
AI summary
A semiconductor device and associated methods are disclosed. In one example, the electronic device includes a photonic die and a glass substrate. In selected examples, the semiconductor device includes one or more turning mirrors to direct an optical signal between the photonic die and the glass substrate. Configurations of turning mirrors are provided to improve signal integrity and manufacturability.