Optical Unit Mechanical Fixing Mechanism for Semiconductor Laser Modules
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor laser modules with soldered optical units are difficult to repair, as the entire module must be replaced if an optical unit fails, limiting flexibility and increasing costs due to material constraints from thermal expansion coefficients.
Innovation Solution
The optical unit is designed with holes for fixing members, allowing it to be easily attached and detached from a platform or package without solder, enabling the use of materials with varying thermal expansion coefficients and facilitating replacement of individual optical units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder is used to fix the optical unit to the platform, then the optical unit is securely fixed, but the optical unit cannot be removed or replaced once assembled
Solution Approach 1:
The fixing mechanism is segmented into separate components: the optical unit with holes and the platform with protrusions, allowing the optical unit to be detachably fixed to the platform without permanent solder joints, enabling replacement while maintaining secure fixation during operation
Solution Approach 2:
The patent replaces the traditional soldering process with a mechanical fixing system using protrusions and holes that allow the optical unit to be securely attached and detached without solder, solving both the reliability and replaceability requirements
2Adaptability or versatility
If materials with different thermal expansion coefficients are used for the base and platform, then material selection is more flexible, but solder joints may fail due to thermal stress
Solution Approach 1:
The patent replaces the solder joint system with a mechanical interlocking system using protrusions and holes, eliminating the thermal stress problem that plagues solder joints when materials with different thermal expansion coefficients are used, thereby enabling flexible material selection without compromising reliability
3Ease of repair
If the optical unit is designed as a single integrated component, then replacement is simplified, but alignment precision with optical fibers may be compromised
Solution Approach 1:
The patent segments the optical unit into a replaceable module that includes the base and semiconductor laser as an integrated assembly, allowing the entire optical unit to be replaced as one component while maintaining alignment precision through the standardized platform interface and positioning holes
Data Source
AI summary
A circuit conductor is provided on a base. A semiconductor laser is connected to the circuit conductor. Cutout parts on which the circuit conductor is not formed are provided at, for example, the vicinity of the four corners of the base, and a hole is provided at each of the said portions. The holes penetrate the base. Fixing members are inserted through the holes. The fixing members are, for example, male threads. Since the head part of the fixing members is located in the cutout part, the fixing members and the circuit conductor are not in contact with each other. A platform has holes formed at portions corresponding to the holes in the optical unit and female threads formed on the inner surface. The fixing members and the platform are therefore joined. As a result, the optical unit is fixed to the platform.


