Optical Unit Shake Correction Circuit Board Clearance
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Solution Overview
Problem
Conventional optical units with shake correction functions in mobile devices face issues where the flexible circuit board, used for shake correction in pitching and yawing directions, may repeatedly contact other components, leading to potential damage and impairment of the camera's photographing function due to its movement.
Innovation Solution
The optical unit incorporates a magnetic drive mechanism and a circuit board with a band-shaped portion that is pulled around the intermediate-member holder and outer-peripheral side covering portion, with defined gaps to prevent contact between the band-shaped portion and the holder's walls, ensuring the circuit board does not damage during shake correction operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the circuit board is made flexible to enable shake correction in pitching and yawing directions, then the optical unit achieves shake correction functionality, but the circuit board may repeatedly contact other components during movement, leading to potential damage
Solution Approach 1:
The patent introduces an intermediate member (holder frame) that mediates between the movable body (camera module) and the fixed body (external casing). The circuit board is fixed to this intermediate member, which rotates with the movable body during shake correction, preventing the circuit board from contacting other components while still enabling the shake correction function.
Solution Approach 2:
The patent divides the structure into multiple segments: the movable body (camera module), the intermediate member (holder frame), and the fixed body (external casing). This segmentation allows the circuit board to be isolated on the intermediate member, which moves independently during shake correction, preventing contact with components in the fixed body.
2Volume of moving object
If the optical unit is made small-sized for mobile device installation, then the device becomes more compact and suitable for smartphones, but the circuit board has less clearance and is more likely to contact other components during shake correction movement
Solution Approach 1:
The patent employs a nested structure where the movable body is held by the intermediate member, which is in turn held by the fixed body. The circuit board is nested within the intermediate member's holder frame, allowing it to move with the intermediate member during shake correction without contacting the outer fixed body, even in a compact design.
3Volume of moving object
If the band-shaped portion of the circuit board is pulled around tightly to save space, then the optical unit becomes more compact, but the circuit board may contact the holder walls and suffer damage
Solution Approach 1:
The patent applies local quality by creating a specific protective structure (holder frame) with localized clearance around the circuit board's band-shaped portion. This localized space provision allows the circuit board to be pulled around tightly for compactness while preventing contact with the holder walls through the specially designed clearance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents damage to the circuit board during shake correction in mobile devices, maintaining the camera's functionality while reducing the optical unit's size, particularly in the front-back direction.
Implementation Method 1
a magnetic drive mechanism to rotate the movable body with respect to the fixed body so that an optical axis of the camera module is inclined in an arbitrary direction
Data Source
AI summary
In an optical unit with a shake correction function, a first inner-side wall surface disposed on an inner side of a first band-shaped portion of a circuit board in a Y-direction and a second inner-side wall surface disposed on an inner side of a second band-shaped portion of the circuit board in an X-direction are defined in an intermediate-member holder, and a first outer-side wall surface disposed on an outer side of the first band-shaped portion in the Y-direction and a second outer-side wall surface disposed on an outer side of the second band-shaped portion in the X-direction are defined on an outer-peripheral side covering portion. An interval between the first inner-side wall surface and the first outer-side wall surface is smaller than an interval between the second inner-side wall surface and the second outer-side wall surface.