Optical Unit Thermal Stress Buffering via Segmented Connection
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Solution Overview
Problem
Wavelength selective switches using liquid crystal elements as deflection units face issues with temperature-induced deformation and stress, leading to deterioration of optical characteristics due to changes in volume and positional shifts within the optical system.
Innovation Solution
The optical unit incorporates a signal processing element with a modulation layer and a driving substrate, where the temperature controller is connected via a second connection portion that deforms more than the driving substrate, buffering stress and maintaining optical characteristics by controlling temperature from the driving substrate side, and includes a cover connected via a third connection portion for further stress absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a temperature controller such as a heater is used to set the temperature of the deflection unit high for improvement of response speed, then the response speed is improved, but the deflection unit may be damaged and optical characteristics may deteriorate as a result of change in volume of the temperature controller due to temperature change and deformation of the deflection unit due to stress applied thereto
Solution Approach 1:
The patent divides the connection structure into multiple segments: the first connection portion connects the incidence surface to the optical substrate, while the second connection portion connects the driving substrate to the temperature controller. This segmentation allows the second connection portion to specifically absorb thermal expansion stress without transmitting it to the deflection unit, thereby maintaining optical characteristics while enabling temperature control for improved response speed.
Solution Approach 2:
The second connection portion acts as an intermediary element between the temperature controller and the driving substrate. It absorbs the thermal expansion stress generated by the temperature controller through its own deformation, preventing this stress from being transmitted to the deflection unit. This intermediary structure enables the temperature controller to function while protecting the optical components from damage.
2Stress or pressure
If the plate is deformed with the deformation of the deflection unit, then stress is absorbed, but a relative positional relationship of the optical system mounted on the plate may be changed and the optical characteristics may deteriorate
Solution Approach 1:
The connection structure is segmented into two distinct portions with different functions. The first connection portion maintains the precise relative positional relationship of the optical system mounted on the optical substrate. The second connection portion is specifically designed to absorb stress through deformation. This segmentation allows stress absorption without compromising the positional precision of the optical system.
Solution Approach 2:
Different parts of the connection structure are given different properties: the first connection portion is designed to maintain rigidity and positional accuracy for the optical system, while the second connection portion is designed with flexibility to absorb stress through deformation. This local differentiation of mechanical properties allows the system to simultaneously achieve stress absorption and positional precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances response speed while suppressing deformation and deterioration of optical characteristics, ensuring reliable operation by effectively managing stress and heat transfer within the optical unit.
Implementation Method 1
the second connection portion thermally connects the driving substrate and the temperature controller
Implementation Method 2
change in volume of the temperature controller due to temperature change
Data Source
AI summary
A signal processing element that modulates beam from an input/output unit, an optical substrate mounting the signal processing element, and a temperature controller that controls a temperature of the signal processing element are included, the signal processing element includes an incidence surface on which the beam is incident, a modulation layer that modulates the beam from the incidence surface, and a driving substrate for controlling the modulation of the beam arranged on the opposite side of the incidence surface, the temperature controller is arranged opposite the driving substrate, the incidence surface is connected to the optical substrate by a first connection portion, the driving substrate is connected to the temperature controller by a second connection portion, and an area on the temperature controller side of the second connection portion is more greatly deformed than that on the driving substrate side according to change in volume of the temperature controller.