Optical USB Thin Card with Silicon Photonics
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Solution Overview
Problem
Current high-capacity memory cards struggle to transfer data quickly enough for smooth playback of multimedia content on common devices, and existing methods for producing non-planar metal components within these cards are complex and costly.
Innovation Solution
An optical USB thin card with a bidirectional optical transmission module using silicon photonics technology, incorporating a substrate, seat, micro control unit, and function unit to achieve data transfer rates exceeding 10 Gbps, integrating optical fiber for faster data transmission and utilizing hybrid silicon lasers for low-cost, high-bandwidth communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If high-capacity memory cards use traditional USB 3.0 interface, then manufacturing process is simple, but data transfer rate is limited to 4.8 Gbps which is insufficient for smooth multimedia playback
Solution Approach 1:
The patent replaces the traditional electrical USB 3.0 transmission system with an optical transmission system using silicon photonic technology. This substitution enables data transfer rates of 10 Gbps or higher by using light instead of electrical signals, directly resolving the speed limitation while maintaining a relatively simple integrated circuit implementation approach.
Solution Approach 2:
The patent changes the fundamental transmission parameter from electrical signals to optical signals. By using different wavelengths of light for data transmission and adopting silicon photonic integrated circuits, the system achieves significantly higher bandwidth and transfer rates compared to traditional electrical USB interfaces.
2Adaptability or versatility
If COB device with multiple electronic components is used, then functionality is enhanced, but components may be reheated and damaged during soldering process
Solution Approach 1:
The patent segments the device into distinct functional modules: optical transmission module, memory module, and control module. Each module is independently packaged and then integrated, avoiding the need for extensive soldering of multiple small components and reducing thermal stress on individual components during assembly.
Solution Approach 2:
The patent employs composite packaging structures combining different materials optimized for specific functions: heat-dissipating materials for thermal management, shielding materials for signal integrity, and protective materials for component reliability. This composite approach enhances both functionality and component protection.
3Shape
If non-planar metallic plates are manufactured by stamping, then structural flexibility is achieved, but manufacturing process becomes very complicated
Solution Approach 1:
The patent replaces traditional mechanical stamping processes with precision molding techniques used in semiconductor manufacturing. This substitution enables the production of complex non-planar metallic structures with high precision while maintaining manufacturing simplicity and consistency through integrated circuit fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optical USB thin card enables faster data transfer rates than USB 3.0 standards, reaching 10 Gbps or higher, while simplifying the manufacturing process and preventing component damage, thus addressing the limitations of existing memory cards.
Implementation Method 1
a bidirectional optical transmission module, having a plurality of optical fiber, disposed inside the accommodation space while allowing the same to transmit optical data through the at least one opening formed between the seat and the substrate as its data transmission/receiving path
Implementation Method 2
the technology of dense wavelength division multiplexing (DWDM) is rapidly advancing as well so as to achieve a high-capacity versatile broadband service
Data Source
AI summary
Exemplary embodiments of optical USB thin card is disclosed, which includes a substrate, having a space formed inside its packaging layer; a seat, disposed at a position on the substrate while forming an opening on the substrate; a plurality of first contact elements, each being disposed on the seat to be used for connecting electrically with an external device; a plurality of second contact elements, each being disposed on the seat to be used for connecting electrically with an external device; and bidirectional optical transmission module, having a plurality of optical fiber, disposed inside an accommodation space formed by the enclosure of the seat and the substrate; a micro control unit, for processing signals, data and commands of the optical USB thin card.