Optical Wafer-Level Package With Embedded Transceivers and RDL
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Solution Overview
Problem
Conventional wire bond connections in opto-electronic components require tight length tolerances for high-bandwidth signals, complicating package assembly design and alignment, especially in transceivers with multiple fiber channels.
Innovation Solution
The implementation of a wafer-level optical package with a frontside and backside electrical redistribution layer, embedded optical transmitters and receivers within a transparent molding compound, and optical coupling to waveguides, eliminating wire bonds and enhancing integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bond electrical connections are used between optical and electrical ICs, then electrical connectivity is achieved, but length tolerance requirements become tighter for high-bandwidth signals
Solution Approach 1:
The patent replaces the mechanical wire bond connection system with an integrated electrical interconnect structure formed through semiconductor fabrication processes (copper deposition, electroplating, reflow soldering). This substitution eliminates the need for separate wire bonding steps and provides more consistent electrical length control, thereby maintaining signal integrity while relaxing manufacturing precision requirements.
2Reliability
If wire bond connections are used for high-bandwidth signals, then electrical connectivity is established, but alignment tolerance for optical components becomes tighter
Solution Approach 1:
The patent merges the electrical interconnect structure with the optical component mounting structure into a single integrated package substrate. The electrical traces and optical alignment features are co-formed through the same fabrication process steps, ensuring inherent alignment between electrical and optical components. This integration eliminates the need for separate alignment procedures, thereby maintaining signal integrity while significantly improving alignment tolerance.
3Reliability
If conventional wire bond assembly is used in transceivers with multiple fiber channels, then electrical connectivity is achieved, but package assembly complexity increases
Solution Approach 1:
The patent segments the package assembly into modular components: a pre-fabricated package substrate with integrated electrical interconnects and optical mounting features, optical components, and electrical ICs. This segmentation allows each component to be prepared independently using standardized fabrication processes, then assembled together in a simplified sequence. The modular approach maintains electrical connectivity reliability while significantly reducing overall package assembly complexity for multi-channel transceivers.
Data Source
AI summary
In a first embodiment aspect presented in this disclosure, an optical wafer-level (OWL) package includes a frontside electrical redistribution layer (RDL) and a molding compound layer, the OWL package further including at least one of (1) an optical transmitter at least partially embedded within the molding compound layer and electrically coupled to the frontside electrical RDL, the optical transmitter arranged for providing an optically modulated output data signal; or (2) an optical receiver at least partially embedded within the molding compound layer and electrically coupled to the frontside electrical RDL, the optical receiver arranged for receiving an optically modulated input data signal.