Optical Waveguide Sensor Chip Alignment Verification

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Solution Overview

Problem

The optical waveguide measurement system faces errors due to improper mounting of the optical waveguide sensor chip, requiring manual visual checks to ensure the chip's bottom surface is parallel to the placement surface, which is time-consuming and burdensome, especially for multiple tests.

Innovation Solution

Incorporating a contact sensor system with detection switches to automatically verify the proper alignment and mounting of the optical waveguide sensor chip by detecting contact at multiple positions, ensuring the chip's bottom surface is parallel to the holding surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If manual visual check is used to verify chip alignment, then mounting accuracy can be confirmed, but operator burden increases and test time is prolonged

Engineering Contradiction:
Improvechip alignment accuracyVSAvoidtest time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The system performs self-verification of chip alignment through automated detection switches that automatically detect whether the chip is properly mounted without requiring operator intervention. The detection switches mounted on the chip itself enable the chip to verify its own positioning status.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The manual visual inspection process is replaced with an automated electrical detection system using detection switches. The mechanical action of visual checking is substituted with electrical signals from the detection switches that automatically indicate mounting status.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Manufacturing precision

If manual visual check is used to verify chip alignment, then mounting accuracy can be confirmed, but operator burden increases

Engineering Contradiction:
Improvechip alignment accuracyVSAvoidoperator burden
Core Design Contradiction:
Manufacturing precisionVSEase of operation

Solution Approach 1:

The system performs self-verification of chip alignment through automated detection switches that automatically detect whether the chip is properly mounted without requiring operator intervention. The detection switches mounted on the chip itself enable the chip to verify its own positioning status.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The manual visual inspection process is replaced with an automated electrical detection system using detection switches. The mechanical action of visual checking is substituted with electrical signals from the detection switches that automatically indicate mounting status.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If multiple tests are performed, then measurement accuracy can be improved, but the cumulative time burden on operator increases significantly

Engineering Contradiction:
Improvemeasurement accuracyVSAvoidcumulative test time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The detection switches are pre-mounted on the chip before testing begins. This preliminary setup ensures that alignment verification is automatically performed for each test without requiring repeated manual inspection, thereby reducing cumulative time burden while maintaining measurement reliability across multiple tests.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The automated detection system enables continuous testing without interruption for manual verification. The detection switches continuously monitor chip alignment status, allowing multiple tests to be performed in sequence without breaking the workflow for visual checks, thus maintaining measurement reliability while reducing total time.

Inventive Principle:
Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution streamlines the mounting process, reducing operator burden and test time by providing an automated verification of chip alignment, thereby minimizing errors and ensuring accurate measurements.

Implementation Method 1

a contact sensor that detects contact state in two or more detection positions located along an array direction of the first window and the second window

Methodology Applied
Scientific EffectContact detection:

Implementation Method 2

The optical waveguide measurement system includes an optical waveguide sensor chip... by using waveguiding effect

Methodology Applied
Scientific EffectWaveguiding effect: Waveguide (optics)

Data Source

PatentUS10444159B2Optical measurement system
Publication Date: 2019.10.15 CANON MEDICAL SYST CORP
  • US10444159B2 patent drawing
  • US10444159B2 patent drawing
  • US10444159B2 patent drawing

AI summary

A according to one embodiment, an optical measurement system has an optical waveguide sensor chip mounted thereon, the optical waveguide sensor chip has a space defined by a plurality of surfaces including a first surface along which an optical waveguide part is provided. The optical measurement system includes a holding surface, a light transceiver, and a contact sensor. The holding surface holds the bottom surface of the optical waveguide sensor chip. The light transceiver lets light be incident on the optical waveguide sensor chip through a first window in the holding surface, and receives light that has passed through the first surface via the optical waveguide part from a second window in the holding surface. The contact sensor detects contact state in two or more detection positions located along an array direction of the first window and the second window.