Optical Waveguide Connection Assembly Thermal Expansion Mismatch
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Solution Overview
Problem
Existing optical modules face issues with mating deviations between optical waveguide connection assemblies and optical elements due to thermal expansion differences between carriers and circuit boards, leading to alignment problems and increased manufacturing complexity.
Innovation Solution
An optical waveguide connection assembly is directly connected to the optical element using a holder with a first and second part, a connection member, and an optical coefficient adjusting member, where the holder's thermal expansion coefficient matches that of the optical element, eliminating the need for a carrier and simplifying manufacturing, and an index matching fluid is used to enhance beam transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a carrier is used to carry the optical waveguide connection assembly and the optical element, then the relative position can be fixed for alignment, but mating deviation occurs due to thermal expansion differences between the carrier and circuit board
Solution Approach 1:
The patent removes the carrier component from the system entirely. The optical waveguide connection assembly is directly mounted on the circuit board without an intermediate carrier, thereby eliminating the source of thermal expansion mismatch that caused mating deviations.
Solution Approach 2:
The patent merges the carrier function directly into the circuit board structure. The circuit board itself serves as the mounting substrate for the optical waveguide connection assembly, eliminating the separate carrier component and its associated thermal expansion issues.
2Manufacturing precision
If a carrier is used to carry the optical waveguide connection assembly and the optical element, then alignment can be achieved, but the device complexity increases
Solution Approach 1:
The carrier component is extracted and removed from the system. The optical waveguide connection assembly is mounted directly on the circuit board, simplifying the overall structure by eliminating unnecessary intermediate components.
Solution Approach 2:
The circuit board is given multiple functions: it serves as both the electrical circuit substrate and the mechanical mounting platform for the optical waveguide connection assembly, eliminating the need for a separate carrier component.
3Strength
If resin is used to connect the optical waveguide connection assembly and the carrier, then the components can be joined, but manufacturing deviations affect the connecting state and cause mating errors
Solution Approach 1:
The carrier component is removed from the system, which eliminates the resin connection interface between the carrier and optical waveguide connection assembly. This removes the source of manufacturing deviations that affected mating precision.
Solution Approach 2:
The mounting function is merged directly into the circuit board, eliminating the intermediate resin connection layer. The optical waveguide connection assembly is mounted directly on the circuit board, reducing the number of interfaces and potential sources of manufacturing deviation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces material costs, simplifies manufacturing, and prevents mating deviations caused by thermal expansion, while ensuring accurate alignment and improved signal transfer by matching refractive indices.
Implementation Method 1
an optical coefficient adjusting member provided between the optical fiber and the optical element, so that a beam is capable of being transferred between the optical fiber and the optical element via the optical coefficient adjusting member
Implementation Method 2
difference between the carrier 30 and the circuit board 60 in coefficient of thermal expansion (CTE) may cause the carrier 30 and the circuit board 60 to generate warpages at different extents due to thermal effect
Data Source
AI summary
The present disclosure provides an optical waveguide connection assembly and an optical module including the optical waveguide connection assembly. The optical waveguide connection assembly includes a holder, an optical fiber, a connection member and an optical coefficient adjusting member. The holder has a first part and a second part. The first part is positioned a side of the optical element, the second part is positioned above the optical element. The optical fiber is fixed to the first par. The connection member is provided between the second part and the optical element. The optical coefficient adjusting member is provided between the optical fiber and the optical element, so that a beam is capable of being transferred between the optical fiber and the optical element via the optical coefficient adjusting member. The optical waveguide connection assembly is fixed to the optical element via the connection member and the optical coefficient adjusting member.