Optical Waveguide Chip Connection Using Conductive Spacer Alignment
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Solution Overview
Problem
The existing connection structures for optical waveguide chips require additional three-dimensional structures like metal springs for electrical connections, increasing implementation costs and complexity, while also needing precise alignment for effective optical coupling.
Innovation Solution
A connection structure that uses a base substrate with grooves and spacer members to align and mount optical waveguide chips, where the spacer members with conductivity facilitate both mechanical and electrical connections, eliminating the need for separate three-dimensional structures and allowing for passive alignment with high precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional three-dimensional structures like metal springs are used for electrical connections, then electrical connection reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The spacer member is designed to perform multiple functions simultaneously: it provides mechanical support for alignment, maintains precise spacing between waveguide chips, and conducts electrical signals through its conductive material. This integration eliminates the need for separate electrical connection structures like metal springs, thereby reducing device complexity while maintaining connection reliability
Solution Approach 2:
The spacer member serves as a universal component that combines mechanical and electrical functions. By making the spacer conductive, it becomes a multi-functional element that既 provides structural support and alignment as traditional spacers do,又 enables electrical connection, thereby simplifying the overall device architecture
2Reliability
If additional three-dimensional structures like metal springs are used for electrical connections, then electrical connection reliability is improved, but manufacturing cost increases
Solution Approach 1:
The spacer member is designed to perform multiple functions simultaneously: it provides mechanical support for alignment, maintains precise spacing between waveguide chips, and conducts electrical signals through its conductive material. This integration eliminates the need for separate electrical connection structures like metal springs, thereby reducing device complexity while maintaining connection reliability
Solution Approach 2:
The spacer member serves as a universal component that combines mechanical and electrical functions. By making the spacer conductive, it becomes a multi-functional element that既 provides structural support and alignment as traditional spacers do,又 enables electrical connection, thereby simplifying the overall device architecture
3Reliability
If devices are aligned with high precision for optical coupling, then optical connection quality is improved, but alignment difficulty and time increase
Solution Approach 1:
The spacer members are pre-fitted into grooves on the waveguide chips during manufacturing, establishing precise mechanical reference points before the chips are assembled. This preliminary positioning action enables passive alignment during assembly, where the physical geometry of the spacers and grooves automatically guides the chips into correct alignment without requiring time-consuming active alignment procedures
Solution Approach 2:
The invention replaces complex active alignment systems (requiring optical feedback and adjustment mechanisms) with a simpler mechanical passive alignment system. The grooves and spacer geometry provide inherent mechanical guidance that automatically positions the waveguide chips with the required precision, eliminating the need for time-consuming optical adjustment procedures
4Reliability
If devices are aligned with high precision for optical coupling, then optical connection quality is improved, but alignment complexity increases
Solution Approach 1:
The spacer members are pre-fitted into grooves on the waveguide chips during manufacturing, establishing precise mechanical reference points before the chips are assembled. This preliminary positioning action enables passive alignment during assembly, where the physical geometry of the spacers and grooves automatically guides the chips into correct alignment without requiring time-consuming active alignment procedures
Solution Approach 2:
The invention replaces complex active alignment systems (requiring optical feedback and adjustment mechanisms) with a simpler mechanical passive alignment system. The grooves and spacer geometry provide inherent mechanical guidance that automatically positions the waveguide chips with the required precision, eliminating the need for time-consuming optical adjustment procedures
Data Source
AI summary
A connection structure for optical waveguide chips includes a silica-based PLC in which grooves are formed, spacer steel balls fitted in the grooves, and silica-based PLCs in which grooves into which the spacer steel balls to be fitted are formed, the silica-based PLCs being mounted on the silica-based PLC by being supported by the spacer steel balls. A conductor wire formed in the silica-based PLC and a conductor wire formed in the silica-based PLC are electrically connected to each other by a conductor film formed in the groove, the spacer steel balls and a conductor film formed in the groove.