Optical Waveguide Die Packaging for Low-Loss Semiconductor Coupling
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving smaller and more efficient packaging techniques for semiconductor dies, particularly in integrating waveguide dies to enhance optical signal transmission while minimizing optical loss.
Innovation Solution
The proposed solution involves fabricating waveguide dies with semiconductor pillar portions embedded in a dielectric layer, which are then bonded to a semiconductor wafer using a bonding layer. This configuration guides light from an optical fiber to a photoelectric integrated circuit die, reducing optical loss and improving performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If waveguide dies are integrated to enhance optical signal transmission, then optical performance is improved, but device complexity increases
Solution Approach 1:
The waveguide die is embedded within a semiconductor wafer substrate, creating a nested structure where the waveguide die (containing optical components) is integrated into the larger wafer package. This nesting approach allows optical signal transmission enhancement while containing the complexity within a modular die structure that can be systematically integrated.
Solution Approach 2:
The system is divided into separate functional components: a waveguide die for optical signal transmission and a semiconductor wafer for electronic processing. This segmentation allows each component to be optimized independently for its specific function (optical vs. electronic), improving overall system performance while managing complexity through modular design.
2Productivity
If minimum feature size is reduced to increase integration density, then integration density is improved, but manufacturing precision requirements increase
Solution Approach 1:
Instead of increasing integration density solely through lateral miniaturization (reducing feature size in 2D), the patent utilizes the third dimension by embedding the waveguide die within the wafer substrate. This vertical integration approach increases component density without requiring proportional reductions in lateral feature dimensions, thereby easing manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces optical loss and enhances the optical performance by using waveguide dies to guide light between optical fibers and photoelectric integrated circuit dies, thereby improving the integration density and efficiency of semiconductor packaging.
Implementation Method 1
a waveguide die 100A over and optically coupled to the photoelectric integrated circuit die 200, wherein the waveguide die includes a plurality of semiconductor pillar portions 112 extending from the optical fiber 10 to the photoelectric integrated circuit die 200
Data Source
AI summary
A structure adapted to optical coupled to an optical fiber includes a photoelectric integrated circuit die, an electric integrated circuit die, a waveguide die and an insulating encapsulant. The electric integrated circuit die is over and electrically connected to the photoelectric integrated circuit die. The waveguide die is over and optically coupled to the photoelectric integrated circuit die, wherein the waveguide die includes a plurality of semiconductor pillar portions extending from the optical fiber to the photoelectric integrated circuit die. The insulating encapsulant laterally encapsulates the electric integrated circuit die and the waveguide die.