Optical Waveguide Module Ground Connection via Via Holes
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Solution Overview
Problem
The existing optical waveguide device modules experience degradation in transmission line characteristics due to variations in the electric field at connection positions without via holes, leading to inefficiencies in signal transmission.
Innovation Solution
The optical waveguide device module incorporates a connection substrate with a via hole that electrically connects the ground line and back surface ground electrode, with the connection portion of the electrical connection means located near the via hole or filled with conductive material, ensuring improved signal transmission by optimizing the position and proximity of the connection points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is performed at connection positions without via holes, then the connection between optical waveguide device and connection substrate is achieved, but transmission line characteristics degrade due to electric field variations
Solution Approach 1:
The patent applies local quality by creating a specialized connection region with via holes at specific locations where wire bonding occurs. This localized structural modification ensures that the electric field distribution and transmission line characteristics are optimized at the connection points, while the rest of the transmission line maintains its original design. The via holes provide localized ground references that stabilize the electric field where needed most.
Solution Approach 2:
The via holes serve as intermediary elements that mediate between the wire bonding connection points and the ground plane. They provide a controlled impedance path and stable electric field reference at the connection locations, eliminating the need for via holes throughout the entire transmission line while still solving the electric field variation problem at critical connection points.
2Reliability
If via holes are added to improve transmission line characteristics, then electric field stability improves, but device complexity and manufacturing difficulty increase
Solution Approach 1:
Instead of adding via holes throughout the entire connection substrate, the patent applies via holes only at specific local positions where wire bonding connections are made. This selective approach provides the necessary electric field stability at connection points while avoiding the complexity of a via-hole-heavy design, thus improving transmission line characteristics without excessive device complexity.
Solution Approach 2:
The patent uses a partial action approach by implementing via holes only at the necessary connection points rather than uniformly across the entire substrate. This provides sufficient electric field stability for proper transmission line operation without the excessive complexity that would result from comprehensive via hole implementation throughout the structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the transmission line characteristics, particularly in high-frequency regions, by reducing signal degradation and maintaining effective signal transmission across the optical waveguide device and connection substrate interface.
Implementation Method 1
The ground line and the back surface ground electrode are electrically connected to each other through a via hole passing through the connection substrate
Implementation Method 2
The signal electrode 21 and the ground electrode 22 at the input and output ends of the control electrode and the signal line 31 and the ground line 32 of the connection substrate are electrically connected (wire-bonded) to each other by a wire 41
Data Source
AI summary
An optical waveguide device module includes an optical waveguide device and a connection substrate provided outside the optical waveguide device, and these are housed in a housing. The optical waveguide device has a control electrode including a signal electrode and ground electrodes disposed to interpose the signal electrode between the ground electrodes. A signal line, ground lines disposed so as to interpose the signal line between the ground lines, and a back surface ground electrode disposed on a surface of the connection substrate are provided on the connection substrate. The ground line and the back surface ground electrode are electrically connected through a via hole passing through the connection substrate. Electrical connection means for electrically connecting the ground line and the ground electrode is provided. A connection portion of the electrical connection means on the ground line side is in the vicinity of the via hole of the ground line.