Optical Waveguide Structure with Polymer Filling Layer

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Solution Overview

Problem

Current optical waveguide structures face challenges with light field confinement and footprint size, particularly in vertical integration, where 2D integrated types require large footprints and complex manufacturing processes, while 3D integrated types suffer from insufficient light confinement and energy consumption.

Innovation Solution

An optical waveguide structure is designed with a substrate, semiconductor conductive layers, a waveguide layer containing luminescent material, and a polymer filling layer with low viscosity, along with a manufacturing method that involves bonding substrates, forming recesses, and using different etching rates to create an undercut recess, reducing the waveguide layer and footprint.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If 2D integrated optical waveguide structure is used, then light transmission is achieved, but footprint area becomes large and manufacturing process complexity increases

Engineering Contradiction:
Improvefootprint areaVSAvoidmanufacturing process complexity
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent transitions from 2D horizontal integration to 3D vertical integration by stacking multiple functional layers (substrate, buffer layer, active layer, cladding layer, encapsulation layer) in the vertical dimension. This enables light transmission while significantly reducing the footprint area and simplifying manufacturing processes through vertical stacking rather than horizontal expansion.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The optical waveguide structure is segmented into multiple functional layers with distinct roles: substrate for support, buffer layer for stress management, active layer for light generation/transmission, cladding layer for light confinement, and encapsulation layer for protection. This segmentation allows each layer to be optimized independently while achieving overall system goals of reduced footprint and simplified manufacturing.

Inventive Principle:
Principle #1Segmentation

2Area of stationary object

If 3D integrated optical waveguide structure is used, then footprint area is reduced, but light field confinement becomes insufficient

Engineering Contradiction:
Improvefootprint areaVSAvoidlight field confinement
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The patent applies local quality by creating an undercut recess structure where the cladding layer extends laterally beyond the active layer at specific locations. This local structural modification enhances light field confinement at critical interfaces without requiring the entire structure to be more complex, thereby maintaining compact footprint while improving optical performance.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent uses composite material structures with different refractive indices arranged in specific configurations (active layer with luminescent material, cladding layer with different optical properties) to achieve effective light field confinement. The combination of materials with complementary optical properties creates strong confinement at interfaces while maintaining a compact 3D structure.

Inventive Principle:
Principle #40Composite materials

3Manufacturing precision

If conventional etching process is used, then manufacturing is achieved, but manufacturing precision and light field confinement are insufficient

Engineering Contradiction:
Improvestructural precisionVSAvoidetching process complexity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent utilizes parameter changes in etching selectivity between different materials (active layer vs. cladding layer vs. buffer layer) to achieve the undercut recess structure. By controlling etching parameters such as etchant composition, temperature, and exposure time, the process selectively removes material to create precise geometric features that enhance light confinement while maintaining manufacturing feasibility.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides effective light field confinement and reduces the optical waveguide structure's footprint, facilitating vertical integration with other devices and simplifying manufacturing steps.

Implementation Method 1

a first confining layer disposed on the first-type semiconductor conductive layer; a waveguide layer disposed on the first confining layer, and comprising a luminescent material; a polymer filling layer disposed on the first confining layer and adjacent to the waveguide layer

Methodology Applied
Scientific EffectTotal Internal Reflection: Total Internal Reflection

Data Source

PatentUS10802217B2Optical waveguide structure and manufacturing method thereof
Publication Date: 2020.10.13 NAT SUN YAT SEN UNIV
  • US10802217B2 patent drawing
  • US10802217B2 patent drawing
  • US10802217B2 patent drawing

AI summary

An optical waveguide structure and a manufacturing method thereof are provided. The optical waveguide structure includes: a substrate; a first-type semiconductor conductive layer disposed on the substrate; a first confining layer disposed on the first-type semiconductor conductive layer; a waveguide layer disposed on the first confining layer and including a luminescent material; a polymer filling layer disposed on the first confining layer and adjacent to the waveguide layer, wherein the viscosity of the polymer filling layer is less than 52 mm2/s; a second confining layer disposed on the waveguide layer and the polymer filling layer; a cladding layer disposed on the second confining layer; and a second-type semiconductor conductive layer disposed on the cladding layer.