Optical Waveguide Resin Composition for Bending and Heat Resistance
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Solution Overview
Problem
Current resin compositions for optical waveguides fail to simultaneously achieve transparency, bending properties, and heat resistance, as reducing crosslink density compromises heat resistance, while increasing it sacrifices bending properties, and lacks sufficient patterning and solvent resistance.
Innovation Solution
A resin composition combining (meth)acrylate monomers with and without epoxy groups, undergoing epoxy crosslinking to form a polymer with a specific molar ratio and molecular weight range, enhancing transparency, bending, and heat resistance, and incorporating a cationic or anionic curing initiator for improved processing and properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If crosslink density is reduced to improve bending properties, then bending property is improved, but heat resistance deteriorates
Solution Approach 1:
The patent applies parameter changes by precisely controlling the molecular weight of the polymer (50,000-500,000) and the molar ratio of epoxy monomer to non-epoxy monomer (1:1 to 1:20). These parameter optimizations enable the resin to achieve both adequate bending flexibility and heat resistance simultaneously, resolving the contradiction between softness and thermal stability.
Solution Approach 2:
The patent uses composite materials by combining epoxy monomers with non-epoxy monomers (such as (meth)acrylate or vinyl monomers) in specific ratios. This composite resin system allows the cured product to exhibit both flexibility for bending and thermal resistance, overcoming the limitation of single-material systems where improving one property sacrifices the other.
2Temperature
If crosslink density is increased to improve heat resistance, then heat resistance is improved, but bending property deteriorates
Solution Approach 1:
The patent optimizes the crosslink density parameter by controlling the epoxy equivalent and the molar ratio of monomers, achieving a balanced crosslinking structure that provides sufficient heat resistance while maintaining bending flexibility. The molecular weight control (50,000-500,000) prevents excessive crosslinking that would cause brittleness.
Solution Approach 2:
By form a composite resin system combining epoxy monomers (providing heat resistance through crosslinking) with non-epoxy monomers (providing flexibility), the patent achieves a material that simultaneously delivers high heat resistance and good bending properties, eliminating the need to choose between the two extremes.
3Ease of manufacture
If resin composition is simplified to reduce manufacturing complexity, then ease of manufacture is improved, but patterning property and solvent resistance deteriorate
Solution Approach 1:
The patent optimizes the molecular weight parameter (50,000-500,000) and monomer composition ratios to achieve adequate patterning property and solvent resistance. These parameter controls ensure that despite the simplified two-component system, the resin maintains sufficient performance for precise optical waveguide fabrication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves high-speed transmission, weight reduction, downsizing, and space savings in optical circuits with excellent transparency, bending properties, and heat resistance, enabling efficient manufacturing of optical waveguides and photoelectric composite wiring boards.
Implementation Method 1
a cured product by epoxy crosslinking a polymer comprising a (meth)acrylate monomer with an epoxy group (A) and a (meth)acrylate monomer without an epoxy group (B)
Implementation Method 2
incorporating a cationic or anionic curing initiator for improved processing and properties
Data Source
AI summary
The present invention provides an optical waveguide excellent in all of transparency, a bending property and heat resistance and a dry film for manufacturing an optical waveguide. A clad layer of the optical waveguide according to the present invention is formed by using a dry film containing a polymer comprising at least a (meth)acrylate monomer with an epoxy group and a (meth)acrylate monomer without an epoxy group; and cationic or anionic curing initiator.