Optical Waveguide Resin with Fluorophenyl Photocuring for 365 nm Imaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing resin compositions for optical waveguides lack sufficient photosensitivity for direct imaging methods, particularly at wavelengths of 365 nm or 407 nm, limiting their effectiveness in forming high-density optical waveguides with narrow pitches and multilayer structures.
Innovation Solution
A resin composition for optical waveguides containing a solid bisphenol A epoxy compound with specific epoxy equivalents and a photocuring agent comprising a sulfonium salt with fluorophenyl groups, enhancing photosensitivity and enabling efficient photocuring using i-line light, which can be used to form a dry film for optical waveguides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional epoxy resin composition is used for optical waveguides, then heat resistance is maintained, but photosensitivity is insufficient for direct imaging methods
Solution Approach 1:
The patent changes the chemical parameters of the epoxy resin by selecting specific compounds with epoxy equivalents of 400-1500 g/eq, which optimizes the balance between heat resistance and photosensitivity. This parameter adjustment enables the resin to achieve sufficient photocurability for direct imaging while maintaining thermal stability
Solution Approach 2:
The patent creates a composite resin composition by combining multiple epoxy compounds with different epoxy equivalents in specific ratios (5-50 wt% of the high epoxy equivalent compound). This composite approach synergistically improves photosensitivity while preserving heat resistance, resolving the contradiction between these two properties
2Productivity
If the resin composition has high photosensitivity for direct imaging, then photocuring efficiency improves, but heat resistance may be compromised
Solution Approach 1:
The patent adjusts the epoxy equivalent parameter to a specific range (400-1500 g/eq) that simultaneously optimizes photosensitivity and heat resistance. This precise parameter control allows the resin to achieve high photocuring efficiency while maintaining excellent thermal stability
Solution Approach 2:
The patent introduces local quality differentiation by using a mixture of epoxy compounds with different characteristics. The high epoxy equivalent compound (400-1500 g/eq) provides photosensitivity, while the balanced composition maintains overall heat resistance, allowing different regions of the material properties to serve different functions
3Reliability
If conventional epoxy resins are used, then material stability is maintained, but optical loss is high due to insufficient photocuring
Solution Approach 1:
The patent changes the epoxy equivalent parameter to optimize photocuring completeness. The selected range (400-1500 g/eq) ensures sufficient reaction conversion, reducing unreacted groups that cause optical loss while maintaining the inherent stability of epoxy materials
Solution Approach 2:
The composite resin composition achieves complete photocuring by combining epoxy compounds with complementary properties. This ensures high conversion rates that minimize optical loss while preserving the material stability characteristic of epoxy resins
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition allows for high-degree photocurability, resulting in optical waveguides with reduced optical loss and improved heat resistance, suitable for high-density wiring applications.
Implementation Method 1
a process step of photocuring a resin composition for optical waveguides by irradiating the resin composition with a light ray
Implementation Method 2
The resin composition allows for high-degree photocurability, resulting in optical waveguides with reduced optical loss and improved heat resistance
Data Source
AI summary
A resin composition according to the present disclosure is designed for use in optical waveguides. The resin composition contains an epoxy resin (A) and a photocuring agent (B). The epoxy resin (A) includes a solid bisphenol A epoxy compound (A-1) having an epoxy equivalent equal to or greater than 400 g/eq and equal to or less than 1500 g/eq. The photocuring agent (B) contains a sulfonium salt (B-1) having a cation including one or more fluorophenyl groups.