Optical Waveguide Substrate Integration via Inclined Mirror Formation
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Solution Overview
Problem
The existing methods for producing optical waveguide mounted substrates require separate production of electrical circuit substrates and optical waveguides, leading to inefficiencies in working processes and increased production costs, along with the need for specialized positioning and mounting of optical waveguides.
Innovation Solution
The method involves forming a 45-degree inclined reflecting mirror directly on the electrical circuit substrate as an extension of its production, integrating the optical waveguide onto the substrate, which includes a lower cladding layer, a core layer, and an upper cladding layer with metal mirrors, allowing for the optical waveguide to be formed in conjunction with the electrical circuit substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate production of electrical circuit substrate and optical waveguide is employed, then each component can be independently manufactured, but production process complexity and time increase
Solution Approach 1:
The patent merges the electrical circuit substrate and optical waveguide into a single integrated substrate structure. The optical waveguide is formed directly on the electrical circuit substrate through a unified production process, eliminating the need for separate manufacturing and assembly of these components. This integration directly addresses the productivity issue by reducing the number of discrete manufacturing steps and assembly operations required.
2Ease of manufacture
If separate production of electrical circuit substrate and optical waveguide is employed, then each component can be independently manufactured, but manufacturing process steps increase
Solution Approach 1:
The production processes for the electrical circuit substrate and optical waveguide are merged into a single integrated manufacturing flow. The optical waveguide layers are formed on the electrical circuit substrate using the same production line and process equipment, combining multiple discrete manufacturing processes into one unified process sequence, thereby reducing overall device complexity.
3Adaptability or versatility
If optical waveguide is mounted separately on electrical circuit substrate, then component flexibility is maintained, but positioning and mounting complexity increase
Solution Approach 1:
The optical waveguide is merged with the electrical circuit substrate to form an integrated structure where the waveguide is formed directly on the substrate surface. This eliminates the separate mounting step and associated positioning complexity, as the waveguide and substrate are co-manufactured as a single unit rather than assembled from separate components.
4Reliability
If 45-degree dicer cut and cut surface leveling are performed on optical waveguide, then light reflection is enabled, but production time and cost increase
Solution Approach 1:
The 45-degree inclination and mirror formation are performed as preliminary actions during the optical waveguide fabrication process itself, before the waveguide is completed and mounted. By incorporating the light reflection structure formation into the initial manufacturing steps rather than adding it later as a separate post-processing operation, the production time and cost are reduced while maintaining the required optical functionality.
5Reliability
If 45-degree dicer cut and cut surface leveling are performed on optical waveguide, then light reflection is enabled, but manufacturing complexity increase
Solution Approach 1:
The inclination processing and mirror formation are performed as preliminary actions during the optical waveguide fabrication process itself, before the waveguide is completed and mounted. By incorporating the light reflection structure formation into the initial manufacturing steps rather than adding it later as a separate post-processing operation, the manufacturing complexity is reduced through process integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the structure of the optical waveguide, reduces production costs and man-hours by integrating the optical waveguide with the electrical circuit substrate, eliminating the need for separate production and positioning of the optical waveguide, and enhances the efficiency of optical signal transmission.
Implementation Method 1
stacking an ultraviolet curable resin layer on the lower cladding layer; partly curing the ultraviolet curable resin layer
Implementation Method 2
forming a metal layer on the inclined face; mirrors 14 are formed on the inclination portions of the 45-degree processed core layer 12 by, for example, vapor deposition of Au
Implementation Method 3
light is reflected at 90 degrees by an inclined mirror so that the light emission direction is parallel to the substrate plane
Data Source
AI summary
A lower cladding layer is formed on a surface of an electrical circuit substrate. A UV curable resin layer is stacked on the lower cladding layer. The resin layer is partly cured, and the other uncured resin layer is removed, thereby forming resin projections. The resin projections are processed so as to have an inclined face. Metal reflecting layers are formed on the inclined faces. A core layer is stacked on the lower cladding layer and the metal reflecting layers, and an upper cladding layer is stacked on the core layer.