Optical Waveguide Substrates for High-Speed Signal Routing
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Solution Overview
Problem
Current input/output signaling between a package substrate and integrated circuit devices relies on metal bumps, which limits scalability and data rate, and introduces electrical crosstalk issues.
Innovation Solution
Implementing a hybrid metal-optical semiconductor die interconnect architecture that uses optical fibers and waveguides to route input/output signals, allowing for increased data rates and decoupling of optical signals from power delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal bumps are used for electrical signaling between package substrate and IC device, then electrical connection is established, but data rate is limited and electrical crosstalk occurs
Solution Approach 1:
The patent replaces electrical signaling through metal bumps with optical signaling through waveguides. Optical signals transmit data at higher rates without electrical crosstalk, directly resolving the contradiction between reliable signal transmission and high data transmission rate.
Solution Approach 2:
The patent introduces waveguides as intermediary structures that carry optical signals between the package substrate and IC device. These waveguides act as mediators that enable high-speed data transmission while isolating optical signals from electrical interference, thus improving both reliability and productivity.
2Adaptability or versatility
If metal bumps are used for electrical signaling, then electrical connection is established, but package substrate size increases and scalability is limited
Solution Approach 1:
The patent substitutes optical waveguide structures for traditional electrical bump interconnects. Optical waveguides have smaller cross-sectional areas and can be more densely packed, enabling smaller package substrates and improved scalability without sacrificing connection functionality.
3Productivity
If optical fibers and waveguides are used to route input/output signals, then data transmission rate increases and electrical crosstalk is reduced, but device complexity increases
Solution Approach 1:
The patent designs the waveguide structures to serve multiple functions: they guide optical signals for high-speed data transmission, provide mechanical support, and enable precise alignment between package substrate and IC device. This multi-functionality reduces the need for separate components, thereby managing device complexity while achieving high data transmission rates.
4Reliability
If optical signals are used instead of electrical signals, then electrical crosstalk is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent integrates the waveguide fabrication process with the existing package substrate manufacturing process. By combining the optical waveguide formation with substrate fabrication steps, the patent reduces manufacturing complexity while maintaining signal transmission quality and eliminating electrical crosstalk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables higher data transmission rates and reduces electrical crosstalk, allowing for smaller package substrates and improved scalability by using optical signals instead of traditional electrical signals.
Implementation Method 1
an optical waveguide 110 coupled with the package substrate 102
Implementation Method 2
bundling one or more optical fibers 108 through one or more plated-through hole (PTH) structures 104 of the package substrate 102
Data Source
AI summary
Package substrates for optical die structures are generally described. In one example, an apparatus includes a package substrate having one or more plated through hole (PTH) structures, an optical waveguide coupled with the package substrate, the optical waveguide having one or more input/output (I/O) optical signal pathways to route I/O signals to and from the package substrate, and one or more optical fibers coupled with the optical waveguide, the one or more optical fibers being disposed in the PTH structures to route I/O signals to and from a motherboard.