Optical Waveguide Bends for High-Density Vertical Coupling
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Solution Overview
Problem
Existing optical interconnect structures face challenges in achieving high integration and efficient vertical interconnects between optical waveguides, limiting the compactness and functionality of optical devices.
Innovation Solution
The formation of optical waveguides with bent portions that extend upwardly or downwardly from major portions, allowing for vertical coupling through inter-layer couplers, which are created by controlled implantation and encapsulation processes to generate compressive stress and facilitate close alignment of bent portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional planar waveguide structures are used, then manufacturing is simpler, but vertical interconnect efficiency and integration density are limited
Solution Approach 1:
The patent transitions from traditional planar waveguide structures to three-dimensional bent waveguide structures that extend vertically between layers. This dimensional change enables vertical optical interconnects between different chip layers, significantly increasing integration density and allowing optical signals to be routed in the vertical dimension rather than being confined to a single plane.
Solution Approach 2:
The waveguide structure is segmented into distinct portions: a first waveguide in a first insulating layer and a second waveguide in a second insulating layer, with bent portions that connect vertically. This segmentation allows independent optimization of each waveguide section and enables the complex three-dimensional interconnect architecture through modular construction.
2Reliability
If bent waveguide portions are formed for vertical coupling, then vertical interconnect efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent introduces an intermediary encapsulation structure that surrounds and protects the bent waveguide portions. This encapsulation layer acts as a mediator that maintains the precise alignment and spacing between the first and second waveguides, ensuring efficient optical coupling while reducing the direct manufacturing precision requirements for the bent portions themselves.
Solution Approach 2:
The patent employs ion implantation to modify the physical and optical parameters of the bent waveguide portions. By changing parameters such as refractive index through implantation, the optical coupling efficiency between vertically separated waveguides is enhanced, allowing for relaxed alignment tolerances and improved manufacturing feasibility.
3Adaptability or versatility
If multiple insulating layers with waveguides are formed, then vertical interconnect functionality is enhanced, but device complexity and process steps increase
Solution Approach 1:
The insulating layers in the patent serve multiple functions: they provide electrical insulation, support and position the waveguide structures, enable vertical spacing for optical coupling, and provide encapsulation for the bent waveguide portions. This multi-functionality reduces the need for separate dedicated structures, thereby managing complexity while enhancing vertical interconnect capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables highly integrated optical interconnect structures with efficient vertical interconnections, enhancing the compactness and functionality of optical devices by allowing optical signals to be transmitted between waveguides in different levels.
Implementation Method 1
performing a first implant process on the first end portion of the first waveguide to form a first bent portion of the first waveguide... performing a second implant process on the second end portion of the second waveguide to form a second bent portion of the second waveguide
Data Source
AI summary
Optical devices and methods of manufacturing the optical devices are provided. In an embodiment, an optical device includes a first insulating layer over a substrate and a first waveguide in the first insulating layer. The first waveguide includes a first major portion and a first bent portion extending upwardly from the first major portion away from the substrate. The optical device also includes a second waveguide over the first waveguide, and the second waveguide includes a second major portion over the first insulating layer and a second bent portion extending downwardly from the second major portion and into the first insulating layer.