Optical Wavelength Dispersion Device via High-Energy Exposure
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Solution Overview
Problem
Current optical wavelength dispersion devices, such as spectrometers and spectroscopy tools, are inefficient in terms of size and cost due to their assembly from multiple elements and limitations in microfabrication processes like silicon-based micromachining, which struggle with precision and complexity requirements.
Innovation Solution
An optical wavelength dispersion device is developed using a system on chip (SoC) structure with a first substrate featuring an input unit, a grating, and optical reflectors formed from a photo-resist layer via high energy light source exposure, specifically X-ray, soft X-ray, or EUV, to reduce size and cost, with the grating having various profiles and pitches, and a second substrate covering the first for enhanced functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If silicon-based micromachining is used to manufacture optical components, then manufacturing precision can be achieved, but device size and cost become ineffective
Solution Approach 1:
The patent combines multiple optical components (grating, input unit, optical reflectors) that were previously manufactured separately using silicon-based micromachining into a single integrated structure formed by high energy light source exposure. This merging of components directly reduces device size while maintaining manufacturing precision through the unified fabrication process.
Solution Approach 2:
The patent creates a universal fabrication platform using high energy light source exposure that can manufacture multiple different optical components (gratings with various profiles, input units, reflectors) using the same process. This multi-functional approach eliminates the need for separate silicon-based micromachining processes for each component, reducing both device size and manufacturing complexity.
2Adaptability or versatility
If multiple elements are assembled to create optical wavelength dispersion devices, then functional requirements can be met, but device size and cost increase
Solution Approach 1:
The patent merges multiple discrete optical elements (grating, input unit, optical reflectors) into a single integrated structure formed by high energy light source exposure. This consolidation maintains all necessary optical functions while eliminating the complexity of assembling multiple separate elements.
Solution Approach 2:
The patent uses high energy light source exposure to selectively form different functional regions (input unit, grating zones with different profiles, optical reflectors) within a single integrated structure. This segmentation approach allows complex multi-functional devices to be created without requiring physical assembly of multiple elements.
3Manufacturing precision
If LIGA process is used to manufacture vertical grating with large structural height, then structural precision can be achieved, but manufacturing yield becomes insufficient
Solution Approach 1:
The patent replaces the mechanical de-molding process of LIGA with a high energy light source exposure process. This substitution eliminates the bottleneck in the LIGA process that limits manufacturing yield, while still achieving the necessary precision for vertical gratings with large structural heights through direct photofabrication.
Solution Approach 2:
The patent changes the fabrication parameter from conventional lithography wavelengths to high energy light sources (X-ray, soft X-ray, or EUV with wavelengths from 0.01 to 100 nm). This parameter change enables direct formation of high-precision vertical grating structures with large heights without the yield limitations of LIGA de-molding processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a compact and cost-effective optical wavelength dispersion device capable of efficiently dispersing light across different wavelengths, addressing the limitations of existing technologies by enabling precise microstructure fabrication and integration within a SoC framework.
Implementation Method 1
the input unit, the first optical reflector and the grating are formed from a photo-resist layer by high energy light source exposure
Implementation Method 2
the input unit, the first optical reflector and the grating are formed from a photo-resist layer by high energy light source exposure
Implementation Method 3
a grating for producing diffracted light beams from the optical signal
Implementation Method 4
a first optical reflector formed on the first substrate for reflecting the diffracted light beams from the grating for outputting
Data Source
AI summary
An optical wavelength dispersion device includes a first substrate, an input unit formed on the first substrate having a slit for receiving an optical signal, a grating formed on the first substrate for producing a diffracted light beams from the optical signal, a first optical reflector formed on the first substrate for reflecting the diffracted light beams from the grating for outputting, and a second substrate covered on the top of the input unit and the grating, wherein the input unit, the grating and the first optical reflector are formed from a photo-resist layer by high energy light source exposure.


