Optical Writing Waveguide Block for Multi-Coupler Interconnects
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Solution Overview
Problem
Current optical chip coupling technologies fail to meet requirements for compatibility between different coupling manners, high density, and efficient, high-precision optical encapsulation, particularly in 'chip-optical fiber' and 'chip-chip' coupling applications.
Innovation Solution
An optical coupling apparatus and method utilizing an optical writing waveguide block that can be coupled to optical chips and optical fibers in various coupling manners, including adiabatic, grating, and edge couplers, enabling compatibility and high-density multi-core optical fiber transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a complex optical coupling structure is used to achieve optical signal transmission between different optical chips or between an optical chip and an optical fiber, then the optical signal transmission can be achieved, but the device complexity increases and the manufacturing precision requirements become higher
Solution Approach 1:
The patent introduces an optical coupling structure comprising a first optical coupling component and a second optical coupling component as intermediary elements. The first optical coupling component (e.g., grating coupler or edge coupler) is formed on the first optical chip, and the second optical coupling component is formed on the second optical chip or optical fiber. These intermediary components facilitate optical signal transmission between different optical chips or between an optical chip and an optical fiber, resolving the technical contradiction by providing a standardized coupling interface that reduces overall system complexity while ensuring reliable signal transmission.
Solution Approach 2:
The optical coupling structure is segmented into distinct functional components: the first optical coupling component on the first optical chip, the second optical coupling component on the second optical chip or optical fiber, and the optical writing waveguide block for signal transmission. This segmentation allows each component to be optimized independently for its specific function, reducing manufacturing complexity while maintaining transmission reliability.
2Manufacturing precision
If different coupling manners (EC, GC, AC) are used for different optical chips, then specific coupling requirements can be met, but compatibility between different coupling manners is lost
Solution Approach 1:
The patent implements universality by designing the optical coupling structure to support multiple coupling manners. The first optical coupling component can be configured as an edge coupler (EC), grating coupler (GC), or adiabatic coupler (AC), and the second optical coupling component can similarly be configured. This multi-functionality allows the same basic coupling structure to accommodate different coupling techniques, enabling compatibility between EC, GC, and AC while maintaining the manufacturing precision required for each specific coupling manner.
Solution Approach 2:
The optical coupling structure employs dynamic configurability where the coupling components can be adjusted or selected based on specific application requirements. The system can dynamically adapt between different coupling manners (EC, GC, AC) depending on the optical chip characteristics and transmission requirements, thereby achieving both high coupling precision and broad compatibility.
3Quantity of substance
If a single optical fiber connector includes not less than 84 channels with density not less than 5.25 channels/mm2, then high density is achieved, but the manufacturing precision and alignment difficulty increase
Solution Approach 1:
The patent replaces traditional mechanical alignment systems with an optical writing waveguide block that uses optical field-based coupling. The optical writing waveguide technology enables precise waveguide formation and coupling without relying on mechanical positioning, thereby achieving high channel density (84 channels or more per connector with density ≥5.25 channels/mm2) while maintaining the required alignment precision through optical field overlap rather than mechanical tolerance stacking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves compatibility between multiple coupling manners, satisfies high-density optical coupling requirements, and enables efficient, high-precision optical signal transmission and encapsulation, reducing insertion loss.
Implementation Method 1
an optical writing waveguide block, where the first optical chip is coupled to the optical writing waveguide block in a first coupling manner, and the second optical chip is coupled to the optical writing waveguide block in a second coupling manner; and the first optical chip is optically interconnected to the second optical chip using the optical writing waveguide block
Data Source
AI summary
An optical coupling apparatus and method are described. An embodiment of an optical coupling apparatus may include a first optical chip, a second optical chip, and an optical writing waveguide block. In the apparatus, the first optical chip is coupled to the optical writing waveguide block in a first coupling manner, and the second optical chip is coupled to the optical writing waveguide block in a second coupling manner. Furthermore, in the apparatus, the first optical chip is optically interconnected to the second optical chip by using the optical writing waveguide block. Compatibility between a plurality of coupling manners is therefore enabled by using the technical solutions described herein.