Optically-Cured Dielectric Package Substrate for Thin Semiconductor Devices
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Solution Overview
Problem
Semiconductor device packages face a challenge in achieving a thin thickness while maintaining sufficient structural strength to support semiconductor dies and electronic components, as thick substrates are required for structural integrity but increase the overall package thickness.
Innovation Solution
A package substrate is designed with an optically-cured dielectric layer and a sacrificial layer, where the optically-cured dielectric layer is patterned to expose conductive pads without damaging them, and the sacrificial layer provides temporary structural support that can be removed after component encapsulation, allowing for a thinner final product.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the package substrate is made thick to provide sufficient structural strength, then the structural strength is improved, but the overall thickness of the semiconductor device package increases
Solution Approach 1:
The package substrate is divided into multiple functional layers including a carrier substrate, a circuit layer, and a dielectric layer with embedded conductive structures. This segmentation allows each layer to contribute to structural strength while maintaining thin individual layer thicknesses, resolving the contradiction between overall substrate thickness and structural strength.
Solution Approach 2:
The invention uses composite structures combining different materials with complementary properties: the carrier substrate provides mechanical strength, the dielectric layer provides electrical isolation, and embedded conductive blocks provide both electrical connection and structural support. This composite approach enables sufficient structural strength without increasing the overall package thickness.
2Length of stationary object
If the package substrate is made thin to reduce overall thickness, then the compactness is improved, but the structural strength decreases
Solution Approach 1:
The dielectric layer is selectively patterned to expose specific regions where conductive blocks are located, while other regions remain covered for structural support. This local differentiation allows the substrate to be thin overall while maintaining structural integrity in critical areas through the reinforced conductive block structures.
Solution Approach 2:
The invention transitions from a planar two-dimensional substrate to a three-dimensional structure with vertically stacked layers and embedded conductive blocks. This dimensional change allows structural strength to be achieved through vertical stacking and embedding rather than increasing horizontal substrate thickness.
3Length of stationary object
If traditional grinding processes are used to thin the substrate, then the thickness is reduced, but additional processing steps and time are required
Solution Approach 1:
The circuit layer and conductive blocks are formed within the dielectric layer during the substrate fabrication process itself, before final assembly. This preliminary formation of thin structures eliminates the need for subsequent grinding or thinning operations, reducing manufacturing steps and improving productivity.
Solution Approach 2:
The invention replaces mechanical grinding processes with a fabrication approach using deposition, patterning, and curing processes. Instead of mechanically removing material to achieve thinness, the thin structures are built up selectively through controlled material deposition and optical curing, eliminating the need for grinding equipment and associated processing time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a package substrate with reduced thickness and enhanced structural strength, allowing for compact semiconductor device packages without the need for additional thickness from grinding processes, thus meeting the requirements of consumer electronics.
Implementation Method 1
The optically-sensitive material is optically cured to form an optically-cured dielectric layer
Data Source
AI summary
A package substrate and method of manufacturing a package substrate and a semiconductor device package are provided. The package substrate includes a circuit layer, an optically-cured dielectric layer, a plurality of block layers and a sacrificial layer. The circuit layer includes a plurality of conductive pads. The optically-cured dielectric layer has an upper surface and a lower surface opposite to the upper surface. The optically-cured dielectric layer covers the circuit layer, and first surfaces of the conductive pads are at least partially exposed from the upper surface of the optically-cured dielectric layer. The block layers are respectively disposed on the first surfaces of the conductive pads exposed by the optically-cured dielectric layer. The sacrificial layer is disposed on the optically-cured dielectric layer and covering the block layers.