Optically Enhanced Multichip Packaging for Dense Chiplet Links
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Solution Overview
Problem
Chip-to-chip connections in integrated circuits (ICs) are less dense and require more power compared to on-chip connections, limiting the performance and efficiency of chiplets in high-performance computing applications.
Innovation Solution
Implementing optical chip-to-chip interconnects using microLEDs as light sources, with parallel optical links (POLs) that provide high connection density, low power consumption, and low latency, and integrating microLEDs and photodetectors with ICs through hybrid or monolithic methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If chip-to-chip connections are implemented using traditional electrical interconnects, then the ICs can be connected and communicate, but the connection density is low and power consumption is high
Solution Approach 1:
The patent replaces electrical interconnects with optical interconnects using microLEDs as light sources and photodetectors as receivers. This substitution of the transmission medium (from electrical signals to optical signals) enables significantly higher connection density and lower power consumption, as optical signals can be transmitted through waveguides with minimal interference and lower energy requirements compared to traditional electrical interconnects
Solution Approach 2:
The patent changes the fundamental parameter of signal transmission from electrical to optical domain. By using microLEDs operating at specific wavelengths and photodetectors tuned to detect these wavelengths, the system achieves higher bandwidth and density while reducing power consumption through the inherent properties of optical transmission in waveguide structures
2Loss of time
If chip-to-chip connections are implemented using traditional electrical interconnects, then the ICs can be connected and communicate, but the latency is high compared to optical communication
Solution Approach 1:
The patent replaces electrical interconnects with optical interconnects using microLEDs as light sources and photodetectors as receivers. This substitution of the transmission medium (from electrical signals to optical signals) enables significantly higher connection density and lower power consumption, as optical signals can be transmitted through waveguides with minimal interference and lower energy requirements compared to traditional electrical interconnects
Solution Approach 2:
The patent employs time-division multiplexing where microLEDs are modulated at high frequencies to transmit multiple data streams sequentially through the same optical path. This periodic modulation allows multiple channels to share the physical infrastructure, achieving high connection density while maintaining low latency through efficient time-sliced communication
3Reliability
If SoCs are de-integrated into smaller chiplets to optimize process for different functions, then each chiplet can be optimized and yield increases, but the number of chip-to-chip connections required increases significantly
Solution Approach 1:
The patent replaces electrical interconnects with optical interconnects using microLEDs as light sources and photodetectors as receivers. This substitution of the transmission medium (from electrical signals to optical signals) enables significantly higher connection density and lower power consumption, as optical signals can be transmitted through waveguides with minimal interference and lower energy requirements compared to traditional electrical interconnects
Solution Approach 2:
The patent transitions from planar electrical interconnects to three-dimensional optical waveguide structures. By utilizing vertical stacking and multi-layer waveguide arrangements, the system achieves high connection density in the vertical dimension, allowing multiple chiplets to be interconnected through optical paths that extend in the Z-direction rather than being constrained to two-dimensional electrical routing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves high connection density and low power consumption, enabling efficient optical communication between ICs with latency approaching the speed of light, suitable for high-performance processing and networking applications.
Implementation Method 1
optical chip-to-chip interconnects with microLEDs as light sources
Implementation Method 2
integrating microLEDs and photodetectors with ICs
Data Source
Figure 1
Figure 2a~2c
Figure 3a~3c
AI summary
Optical chip-to-chip interconnects may use microLEDs as light sources. The interconnected chips may be on a same substrate. A pair of endpoint chips may each have associated optical transceiver subsystems, with transceiver circuitry in transceiver chips. Optical communications may be provided between the optical transceiver subsystems, with the optical transceiver subsystems in communication with their associated endpoint chips by way of metal layers in the substrate.