Optically Offset 3D Imager for Higher Pixel-Density Triangulation

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Solution Overview

Problem

The precision of three-dimensional imaging using structured-light techniques is limited by the resolution of spatial light modulators (SLMs) and sensor arrays, leading to high costs due to the geometric increase in the cost of sensors, SLMs, and associated optics and circuitry.

Innovation Solution

An imager system that includes a light source, spatial light modulator, sensor, and processor to capture and process combined images using deconvolution techniques, effectively increasing pixel density without the need for higher-resolution components by employing optical blurring compensation through inverse filtering.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If higher resolution SLM and sensor are used to improve imaging precision, then measurement precision is improved, but device cost increases geometrically

Engineering Contradiction:
Improveimaging precisionVSAvoiddevice cost
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent segments the imaging process into multiple lower-resolution captures with different optical blur characteristics, then combines them computationally to achieve high-resolution results without requiring a single high-resolution sensor or SLM

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent changes optical parameters (focal length, aperture, focus distance) to create multiple images with different blur characteristics, then uses computational processing to reconstruct high-resolution depth maps from these varied parameter captures

Inventive Principle:
Principle #35Parameter changes

2Measurement precision

If higher resolution sensor array is used to improve depth map accuracy, then measurement precision is improved, but manufacturing cost increases

Engineering Contradiction:
Improvedepth map accuracyVSAvoidmanufacturing cost
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The patent creates multiple computational copies of the imaging process with different optical parameters, then synthesizes a high-resolution depth map from these copies without physically manufacturing a high-resolution sensor array

Inventive Principle:
Principle #26Copying

3Measurement precision

If multiple images with different blur are captured and combined, then pixel density increases, but processing complexity increases

Engineering Contradiction:
Improvepixel densityVSAvoidprocessing complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent replaces complex optical mechanical systems (high-resolution lenses, precise focusing mechanisms) with computational processing that combines multiple lower-resolution images to achieve high pixel density

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Achieves higher accuracy in three-dimensional imaging with improved pixel density, reducing the need for expensive high-resolution sensors and SLMs, thus lowering costs and enhancing imaging precision.

Implementation Method 1

A light source modulated by a spatial light modulator (SLM) often provides the structured light

Methodology Applied
Scientific EffectLight modulation:

Implementation Method 2

A sensor or sensor array captures the structured light reflected off the object

Methodology Applied
Scientific EffectLight reflection: Reflection

Implementation Method 3

Epipolar geometry, such as triangulation, determines a three-dimensional point location for the points in the portion of the object illuminated by the structured light

Methodology Applied
Scientific EffectTriangulation:

Implementation Method 4

a processor to receive sensed images of the first reflected light and the offset reflected light and apply a deconvolution to a combined image including a combination of the sensed images

Methodology Applied
Scientific EffectDeconvolution:

Data Source

PatentUS12556673B2Optically offset three-dimensional imager
Publication Date: 2026.02.17 TEXAS INSTRUMENTS INC
  • US12556673B2 patent drawing
  • US12556673B2 patent drawing
  • US12556673B2 patent drawing

AI summary

Described examples include an imager includes a light source; a spatial light modulator to receive light from the light source and to provide patterned light to illuminate an object; a sensor to receive a first and an offset reflected light from reflection of the patterned light off an object; and a processor to receive sensed images of the first reflected light and the offset reflected light and apply a deconvolution to a combined image including a combination of the sensed images of the first reflected light and the offset reflected light to generate the combined image having pixel density greater than the sensed images of the first reflected light and the offset reflected light, wherein the processor is configured to determine a position of at least one point on the object by triangulation between the spatial light modulator and the sensor using the patterned light and the combined image.