Optics and Copper Package Cooling With Rotatable Conduits
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Solution Overview
Problem
The integration of optical modules on switch motherboards and near the main die in electronic modules leads to complex heat fluxes and space congestion, complicating effective cooling due to power densities and sensitive cabling, while existing copper-based interconnections and pluggable active optical modules face challenges with signal issues and length restrictions.
Innovation Solution
A cooling system comprising a cold plate, cooling conduits, and coupling blocks that allow rotation for access, using heat pipes and satellite plates to thermally couple and actively or passively cool optical modules, with fluid hoses and closed-loop thermosiphons to manage heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If optical modules are integrated near the main die on switch motherboards, then data transmission speed and system integration are improved, but heat flux complexity and space congestion increase, complicating effective cooling
Solution Approach 1:
The cooling system is segmented into multiple independent cooling conduits, each dedicated to specific optical modules or heat sources. This segmentation allows independent thermal management of different regions, simplifying the complex heat flux management by treating each segment separately rather than as a unified system.
Solution Approach 2:
A cold plate serves as an intermediary thermal management component positioned between the optical modules and the main die. The cold plate receives cooling fluid through conduits and distributes cooled surfaces to multiple heat-generating components simultaneously, acting as a mediator that simplifies the thermal coupling between multiple sources and the cooling system.
2Reliability
If cooling conduits are fixed in position to ensure thermal contact, then cooling effectiveness is improved, but access to optical modules for maintenance becomes difficult
Solution Approach 1:
The cooling conduits are designed with rotational joints or flexible sections that allow dynamic repositioning. The conduits can rotate or flex to maintain thermal contact with optical modules during operation, then be moved away to allow access for maintenance. This dynamic capability resolves the contradiction between fixed thermal contact and maintenance accessibility.
3Area of stationary object
If multiple cooling conduits are added to cool multiple optical modules, then cooling coverage is improved, but system complexity and potential leak points increase
Solution Approach 1:
Multiple cooling conduits are merged into a single integrated cold plate structure. Instead of treating each conduit as a separate system component, they are combined into one unified cold plate that serves multiple optical modules simultaneously. This merging reduces the number of separate connections and potential leak points while maintaining comprehensive cooling coverage.
Solution Approach 2:
The cold plate serves multiple functions: it acts as a thermal interface for multiple optical modules, a distribution manifold for cooling fluid, and a structural support element. This multi-functionality consolidates what would otherwise be separate components into a single universal element, reducing overall system complexity.
4Use of energy by stationary object
If copper-based interconnections are used for linking servers, then cost and power consumption are reduced, but cable length must be kept under one meter to avoid signal losses
Solution Approach 1:
The patent replaces traditional mechanical copper cable interconnections with optical communication modules. This substitution eliminates the electrical signal transmission limitations of copper (signal loss and length restrictions) while enabling longer transmission distances and higher bandwidth. The optical modules integrate directly into the system architecture, removing the need for external copper cabling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively manages heat fluxes by allowing rotation of cooling conduits for access and precise positioning, reducing the risk of leaks and maintaining uniform cooling across optical modules and the main die, while minimizing system disassembly for maintenance.
Implementation Method 1
The cold plate may be thermally coupled to a main die... The cooling conduit may thermally couple the cold plate to an optical module
Implementation Method 2
the cooling conduit includes a heat pipe... a portion of the heat pipe is positioned between the top module surface and the satellite support
Implementation Method 3
with fluid hoses and closed-loop thermosiphons to manage heat transfer
Data Source
AI summary
Modules, systems, and methods for cooling optics and copper packages are described herein. Some embodiments of the present invention may be directed to cooling systems for cooling electronic modules (e.g., network switches) that include optics and copper packages. An electronic module may include a substrate having a first surface defining a central portion and a peripheral portion. A main die (e.g., an ASIC) may be positioned on the central portion of the first surface, and a plurality of optical modules may be positioned on the peripheral portion of the first surface (e.g., around the main die). A cooling system may include a cold plate thermally coupled to the main die that includes a fluid inlet and a fluid outlet for receiving and releasing a cooling fluid. The cooling system may also include multiple cooling conduits, each thermally coupling the cold plate to an optical module.