Optimization Maps for Electronic Design Thermal and EMI Co-optimization
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Solution Overview
Problem
Modern electronic designs face challenges in managing thermal behaviors and electromagnetic interference (EMI) simultaneously, as more openings for heat dissipation can exacerbate EMI issues, leading to inefficiencies and delays in design processes due to separate teams using different tools and physics domains.
Innovation Solution
The implementation of optimization maps using co-simulations across multiple physics domains, where initial grids are refined into adaptive grids to identify safe regions and index values, guiding the placement of electronic components to optimize both thermal and EMI performance within limited spaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If more openings are added to the enclosure for heat dissipation, then thermal management is improved, but EMI containment deteriorates
Solution Approach 1:
The patent merges thermal analysis and EMI analysis into a single integrated optimization map that simultaneously considers both thermal behaviors and EMI behaviors. This allows the design team to evaluate both thermal management and EMI containment together, identifying configurations that satisfy both requirements without requiring separate iterative analyses.
Solution Approach 2:
The optimization map serves multiple functions: it evaluates thermal performance, EMI performance, and provides guidance for component placement and enclosure design. By creating a universal tool that addresses both thermal and EMI concerns, the patent eliminates the need for separate specialized tools and teams.
2Measurement precision
If separate teams use different tools for thermal and EMI analyses, then specialized analysis is achieved, but design efficiency deteriorates
Solution Approach 1:
The patent combines thermal analysis capabilities and EMI analysis capabilities into a single integrated optimization map framework. This allows both types of analysis to be performed simultaneously with a unified approach, eliminating the inefficiencies of separate teams using different tools while maintaining the specialized accuracy of each analysis type.
3Adaptability or versatility
If iterative guesswork is used for component placement, then design flexibility is maintained, but design time increases
Solution Approach 1:
The optimization map performs preliminary analysis by pre-evaluating multiple configurations and identifying safe regions for component placement before the actual design is finalized. This preliminary action provides guidance that reduces the need for iterative guesswork, allowing designers to make informed decisions upfront while maintaining flexibility to adapt to specific design requirements.
Solution Approach 2:
The optimization map provides feedback by identifying safe regions and index values that indicate the quality of different configurations. This feedback mechanism guides designers toward optimal placements without requiring multiple iterative trials, reducing design time while maintaining the ability to explore different design options.
Data Source
AI summary
Disclosed are methods, systems, and articles of manufacture for implementing an electronic design having embedded circuits. These techniques identify a specification of an electronic design, a parameter for optimization, at least one optimization target for the parameter, and initial grids for the electronic design. An optimization map may be determined, by at one or more optimization modules that are stored at least partially in memory of and function in conjunction with at least one microprocessor of a computing system, for the electronic design at least by performing one or more analyses that refine the initial grids for the optimization map with respect to the parameter and the at least one optimization target. The electronic design may be implemented based at least in part upon the optimization map.