Optimized Vent Walls for Portable Device Thermal Management

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Solution Overview

Problem

Modern portable electronic devices face challenges in efficiently dissipating heat without increasing size or cost, as existing heat-dissipation mechanisms can impinge on displays, causing temperature gradients and visual artifacts that degrade image quality.

Innovation Solution

The implementation of optimized vent walls with angled intake and exhaust vents, obstructed vents, and thermal management techniques such as T-cuts and gaskets to direct heat away from displays while maintaining efficient heat transfer, along with the use of heat pipes and forced-fluid drivers to manage thermal power.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional heat-dissipation mechanisms (heat sinks, cooling fans, heat pipes) are used, then heat dissipation efficiency is improved, but device size and complexity increase

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidnumber of heat-dissipating parts
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent integrates the vent wall structure directly into the device housing, combining the functions of structural support, air intake, and exhaust in a single integrated component. This eliminates the need for separate heat-dissipating parts while maintaining effective thermal management through the unified vent wall design with strategically positioned intake and exhaust zones.

Inventive Principle:
Principle #5Merging (Combining)

2Temperature

If heat-dissipating parts are added to improve cooling, then heat dissipation efficiency is improved, but device cost increases

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoiddevice cost
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The vent wall serves multiple functions simultaneously: it provides structural support for the device housing, acts as an air intake pathway for cooling, serves as an exhaust pathway for hot air discharge, and contributes to the overall aesthetic design. This multi-functionality reduces the need for additional specialized components, thereby lowering manufacturing costs while maintaining effective heat dissipation.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Temperature

If exhaust vents are positioned to maximize heat dissipation, then heat dissipation efficiency is improved, but display quality deteriorates due to temperature gradients

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoiddisplay quality
Core Design Contradiction:
TemperatureVSIllumination intensity

Solution Approach 1:

The vent wall design incorporates localized thermal management features, including strategically positioned intake and exhaust zones that create targeted airflow paths. The design ensures that exhaust vents discharge hot air away from the display area, while intake vents are positioned to draw cool air across heat-generating components. This localized control of thermal pathways maintains display quality by preventing hot air impingement on the display while preserving overall heat dissipation efficiency.

Inventive Principle:
Principle #3Local quality

4Length of moving object

If device thickness is reduced for portability, then device compactness is improved, but heat dissipation capability deteriorates

Engineering Contradiction:
Improvedevice thicknessVSAvoidheat dissipation capability
Core Design Contradiction:
Length of moving objectVSTemperature

Solution Approach 1:

The vent wall design optimizes thermal management by utilizing the surface area of the device housing in addition to the internal volume. By positioning intake and exhaust vents on the exterior surfaces and creating efficient airflow pathways across the device thickness, the design maximizes heat dissipation capability without increasing device thickness. This approach transforms the thermal management strategy from a volume-based to a surface-area-based solution, enabling effective cooling in thin-profile devices.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances heat dissipation efficiency, reduces temperature gradients on displays, and maintains the compact design of portable electronic devices, thereby improving user comfort and device reliability.

Implementation Method 1

heat pipes and forced-fluid drivers to manage thermal power

Methodology Applied
Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

forced-fluid drivers to manage thermal power

Methodology Applied
Scientific EffectForced convection: Forced Convection

Implementation Method 3

a wall of the portable electronic device, containing an intake zone that includes a set of intake vents directed at a first angle toward one or more heat-generating components of the portable electronic device. The wall also includes an exhaust zone containing a set of exhaust vents directed at a second angle out of the portable electronic device

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS10948953B2Optimized vent walls in electronic devices
Publication Date: 2021.03.16 APPLE INC
  • US10948953B2 patent drawing
  • US10948953B2 patent drawing
  • US10948953B2 patent drawing

AI summary

The disclosed embodiments related to a component for use in a portable electronic device. The component includes a wall of the portable electronic device, containing an intake zone that includes a set of intake vents. The wall also includes an exhaust zone containing a set of exhaust vents.