Opto-Electric Hybrid Board Alignment via Metal Layer Integration
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Solution Overview
Problem
Existing opto-electric hybrid boards lack precise alignment between the optical element and the optical waveguide, leading to potential misalignment and increased light propagation losses due to the reliance on alignment marks and adhesive layers, which can introduce errors in the positioning process.
Innovation Solution
The opto-electric hybrid board incorporates a metal reinforcement layer with alignment through holes and alignment marks made of the same metal as the electrical interconnect lines, allowing for precise positioning of the optical element and mirror part using a common reference, eliminating the need for additional alignment steps and reducing the risk of misalignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If alignment marks and adhesive layers are used for positioning the optical element and mirror part, then the optical coupling can be achieved, but the positioning accuracy deteriorates due to errors introduced by the alignment marks and adhesive layers
Solution Approach 1:
The patent merges the alignment mark formation with the electrical interconnect line formation by making them both part of the same metal layer. This integration eliminates the need for separate alignment marks and reduces positioning errors that would arise from multiple positioning steps. The alignment marks are formed simultaneously with the electrical lines through a single photolithography and metal deposition process, ensuring that both features share the same reference frame and minimizing cumulative alignment errors.
Solution Approach 2:
The metal layer serves multiple functions: it forms the electrical interconnect lines, creates alignment marks for positioning, and provides a common reference structure for both electrical and optical components. This multi-functional approach eliminates the need for separate alignment mark structures and reduces the overall complexity of the positioning system while improving accuracy.
2Manufacturing precision
If separate alignment marks are provided for positioning the mirror part and optical element, then positioning can be achieved, but the device complexity increases due to additional alignment steps and components
Solution Approach 1:
The patent combines the alignment mark structure with the electrical interconnect line structure by forming both in the same metal layer. This merger eliminates the need for separate alignment mark components and reduces the number of alignment steps required. The alignment marks are created as an integral part of the electrical line formation process, simplifying the overall device structure and manufacturing process.
Solution Approach 2:
The metal layer performs multiple functions including electrical conduction, alignment reference, and structural support. By making the alignment marks part of the electrical interconnect structure, the patent eliminates redundant components and simplifies the alignment process while maintaining positioning capability.
3Manufacturing precision
If multiple alignment marks and through holes are provided for visual recognition, then positioning accuracy improves, but the manufacturing process becomes more complex and costly
Solution Approach 1:
The patent merges the alignment mark formation with the electrical interconnect line formation by making them both part of the same metal layer. This integration eliminates the need for separate alignment mark fabrication steps and reduces manufacturing complexity. The alignment marks are created simultaneously with the electrical lines through a single photolithography and metal deposition process, maintaining high positioning accuracy while simplifying manufacturing.
Solution Approach 2:
The metal layer serves dual purposes as both electrical interconnect and alignment reference. This multi-functionality eliminates the need for separate alignment mark structures and reduces the number of manufacturing steps required, thereby lowering production costs while maintaining positioning accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures high accuracy in aligning the optical element and waveguide, resulting in lower light propagation losses and higher quality optical coupling, while also simplifying the manufacturing process and reducing costs by integrating alignment features with the electrical interconnect line formation.
Implementation Method 1
an alignment through hole for allowing the first alignment mark on the front surface of the substrate to be visually recognized therethrough from the back surface side of the substrate
Implementation Method 2
light transmitted in the optical waveguide is reflected from a mirror part provided at a downstream end of the optical waveguide to change its direction
Data Source
AI summary
An opto-electric hybrid board according to the present invention includes a substrate including an insulation layer and a metal reinforcement layer. An electric circuit part is provided on the front surface of the substrate, and an optical waveguide part is provided on the back surface thereof. The metal reinforcement layer includes an optical coupling through hole and an alignment through hole. The electric circuit part includes an electrical interconnect line, an optical element, a first alignment mark for positioning of a mirror part, and a second alignment mark for positioning of the optical element. The mirror part of the optical waveguide part is positioned with respect to the first alignment mark visually recognized through the alignment through hole, and the optical element of the electric circuit part is positioned with respect to the second alignment mark.