Opto-electronic Micro-module With Through Hole Substrate

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Solution Overview

Problem

Current fiber-optic network setups with TO-can packages are bulky, complex, and inefficient in optical coupling, leading to high costs and reduced performance due to large volume and assembly complexity.

Innovation Solution

An opto-electronic micro-module is fabricated using a semiconductor-wafer-level process, featuring a monocrystalline or silicon substrate with a through hole and an optical substrate, such as an optical splitter, for efficient assembly and reduced volume, enabling low-cost production and improved signal transmission stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If TO-can package is used for bidirectional optical subassembly, then optical signal transmission can be achieved, but the volume is large and assembly complexity increases

Engineering Contradiction:

Improveoptical signal transmissionVSAvoidpackage volume

Core Design Contradiction:

ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent integrates the WDM filter, optical fibers, and mounting structure into a single integrated optical substrate. This merging of multiple components into one unified structure eliminates the need for separate TO-can packages, thereby reducing overall volume while maintaining optical signal transmission functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The optical substrate serves multiple functions simultaneously: it acts as the mounting platform for optical fibers, houses the WDM filter, provides structural support, and enables bidirectional optical signal transmission. This multi-functionality reduces the number of separate components needed, thereby reducing package volume.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If TO-can package is used for bidirectional optical subassembly, then optical signal transmission can be achieved, but assembly alignment complexity increases

Engineering Contradiction:

Improveoptical signal transmissionVSAvoidassembly alignment complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

By combining the WDM filter and optical fiber mounting structures into a single integrated optical substrate with pre-defined through-holes and alignment features, the patent eliminates complex multi-step alignment procedures. The integrated structure ensures proper alignment is built-in during substrate fabrication rather than requiring complex assembly alignment.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If TO-can package is used for bidirectional optical subassembly, then optical signal transmission can be achieved, but optical coupling efficiency decreases

Engineering Contradiction:

Improveoptical signal transmissionVSAvoidoptical coupling efficiency

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The optical substrate incorporates locally optimized features including precisely positioned through-holes for optical fiber insertion, strategically placed WDM filter positions, and surface characteristics designed to maximize optical coupling efficiency at specific locations. This local optimization ensures high optical coupling efficiency without requiring complex overall package design.

Inventive Principle:

Principle #3Local quality

4Ease of manufacture

If traditional packaging method is used, then optical components can be assembled, but fabrication cost increases

Engineering Contradiction:

Improvecomponent assemblyVSAvoidfabrication cost

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

The integrated optical substrate combines multiple discrete components (WDM filter, optical fiber holders, mounting structure) into a single monolithic structure that can be fabricated using standard semiconductor wafer-level processes. This merging eliminates the need for multiple separate component fabrication and assembly steps, thereby reducing fabrication cost while maintaining ease of manufacture.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces traditional mechanical assembly processes (separate component mounting, alignment, and fastening) with a unified wafer-level fabrication process. This substitution of mechanical assembly with integrated fabrication simplifies manufacturing and reduces costs associated with multi-step assembly operations.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS9448373B2Opto-electronic micro-module and method for forming the same

Publication Date: 2016.09.20 EZCONN

AI summary

An opto-electronic micro-module includes a monocrystalline substrate having a first surface and a second surface parallel to said first surface, wherein a through hole passes from said first surface through said monocrystalline substrate to said second surface; and an optical substrate having a first portion in said through hole and a second portion protruding from said through hole.