Opto-Electronic Sensor Module Stacked Substrates
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Solution Overview
Problem
Current sensor technologies face challenges in achieving miniaturization, high precision, sensitivity, and mass-producibility while maintaining a small form factor and low impact on the sensed magnitude, with existing methods being inefficient and complex in manufacturing and integration.
Innovation Solution
The development of opto-electronic modules comprising a first and third substrate member with a second substrate member in between, featuring transparent portions for light passage, spacer members for alignment, and integrated light detecting and emission elements, allowing for efficient manufacturing and high precision in a compact form.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional sensor manufacturing methods are used, then manufacturing simplicity is maintained, but miniaturization and mass-producibility are compromised
Solution Approach 1:
The sensor module is divided into three separate substrate members (first, second, and third) that can be manufactured independently and then assembled. This segmentation allows each substrate to be optimized for specific functions while enabling parallel manufacturing processes, thus achieving miniaturization without significantly increasing overall manufacturing complexity
Solution Approach 2:
The invention transitions from planar sensor design to a three-dimensional stacked architecture where substrate members are arranged in vertical layers. This dimensional change enables compact integration of multiple optical components (light source, modulator, detector) in a small footprint while maintaining manufacturability through standardized stacking procedures
2Volume of moving object
If sensor miniaturization is pursued, then compact form factor is achieved, but precision and sensitivity deteriorate
Solution Approach 1:
Each substrate member is designed with locally optimized optical properties and component placements. The first substrate contains the light source, the second substrate contains the modulator with precisely positioned transparent and opaque portions, and the third substrate contains the detector. This local optimization ensures high detection precision while maintaining overall miniaturization
Solution Approach 2:
The patent employs optical fields (analogous to pneumatic/hydraulic systems) to transmit information through the stacked substrates. Light paths are carefully designed to pass through transparent portions of the second substrate while being modulated by opaque patterns, enabling precise detection in a compact configuration without mechanical moving parts
3Productivity
If conventional manufacturing methods are used, then manufacturing steps are straightforward, but manufacturing speed and productivity are low
Solution Approach 1:
All optical components and substrate structures are pre-manufactured and prepared before final assembly. The substrate members are fabricated with their respective optical components already integrated, allowing for parallel processing and reducing the number of sequential steps required during final module assembly, thereby increasing manufacturing speed
Solution Approach 2:
Multiple functions are merged into single substrate members. For example, the second substrate integrates both the modulator structure and the transparent/opaque pattern elements into one component. This merging reduces the total number of separate parts and assembly steps, increasing productivity while managing device complexity
4Volume of moving object
If sensor size is reduced, then impact on sensed magnitude is minimized, but manufacturing precision requirements increase
Solution Approach 1:
The second substrate acts as an intermediary layer between the light source (first substrate) and the detector (third substrate). It contains precisely positioned transparent and opaque portions that mediate the optical path, allowing for controlled light modulation while maintaining alignment precision through its structured design
Solution Approach 2:
The substrate members are designed with universal features such as standardized bonding surfaces, alignment marks, and integrated optical paths that can be replicated across multiple units. This universality enables high-precision alignment to be achieved through standardized procedures rather than custom adjustments for each sensor, facilitating mass production of miniaturized sensors
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of compact, high-precision, and sensitive sensor modules that can be mass-produced with minimal impact on the sensed magnitude, offering efficient and precise detection of changes through opto-electronic means.
Implementation Method 1
a second substrate member arranged between said first and third substrate members and comprising one or more transparent portions through which light can pass
Implementation Method 2
a light emission element arranged on and electrically connected to said first substrate member
Implementation Method 3
a light detecting element arranged on and electrically connected to said first substrate member
Data Source
AI summary
The opto-electronic module (1) comprisesa first substrate member (P);a third substrate member (B);a second substrate member (O) arranged between said first and third substrate members and comprising one or more transparent portions (ta, tb) through which light can pass, said at least one transparent portion comprising at least a first optical structure (5a;5a′;5b;5b′);a first spacer member (S1) comprised in said first substrate member (P) or comprised in said second substrate member (O) or distinct from and located between these, which comprises at least one opening (4a;4b);a second spacer member (S2) comprised in said second substrate member (O) or comprised in said third substrate member (B) or distinct from and located between these, which comprises at least one opening (3);a light detecting element (D) arranged on and electrically connected to said first substrate member (P);a light emission element (E) arranged on and electrically connected to said first substrate member (P); anda sensing element (8) comprised in or arranged at said third substrate member (B).Such modules (1) are particularly suitable as sensor modules for sensing a magnitude such as a pressure.