Optoceramic Phosphor Solder Bonding for High-Power Thermal Stability
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Solution Overview
Problem
High optical power applications face thermal damage issues due to heating from pump lasers, as conventional binder materials in phosphor devices are susceptible to destruction when exposed to high power laser energies.
Innovation Solution
The use of an optoceramic phosphor element embedded in a ceramic host, attached to a metal heat sink via a solder bond, which improves heat transfer and prevents cracking during high power laser exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional binder materials are used in phosphor devices, then ease of manufacture is improved, but thermal stability deteriorates under high power laser exposure
Solution Approach 1:
The patent uses optoceramic phosphor materials which are composite materials combining phosphor particles with ceramic matrices. This composite structure provides both the light conversion properties of phosphors and the thermal stability of ceramics, resolving the contradiction between ease of manufacture and thermal stability under high power laser exposure.
Solution Approach 2:
The patent changes the material parameters by transitioning from organic binder materials to inorganic optoceramic materials. This parameter change fundamentally alters the thermal properties, enabling the device to withstand high temperatures and power densities while maintaining manufacturability through established ceramic processing techniques.
2Power
If high power pump laser is used to achieve high optical output, then power output is improved, but thermal damage to binder material worsens
Solution Approach 1:
The optoceramic composite structure enables high power operation by combining the optical conversion capabilities of phosphors with the thermal resistance of ceramics. This allows the device to handle high power pump lasers without the binder material degradation that would otherwise occur.
Solution Approach 2:
The patent converts the harmful thermal effect of high power lasers into a beneficial feature by using materials that thrive at high temperatures. The optoceramic materials are specifically designed to operate at elevated temperatures, turning the previously harmful thermal environment into an acceptable operating condition that enables higher power output.
3Temperature
If optoceramic phosphor is used instead of conventional phosphor with binder, then thermal stability is improved, but device complexity increases due to solder attachment requirements
Solution Approach 1:
The patent applies solder attachment techniques that are universally applicable to various optoceramic phosphor configurations and mounting scenarios. This multi-functional approach allows the same attachment method to serve both electrical connection and thermal management functions, reducing overall device complexity despite the initial increase from using optoceramics.
4Loss of energy
If solder bond is used to attach optoceramic phosphor to heat sink, then heat transfer is improved, but manufacturing precision requirements increase
Solution Approach 1:
The solder attachment process involves precise control of temperature and time parameters during bonding. By optimizing these process parameters, the patent achieves both excellent thermal contact for efficient heat transfer and acceptable manufacturing precision through controlled thermal cycles that accommodate normal manufacturing tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solder bond attachment enables the optoceramic phosphor to withstand high power laser energies without cracking, maintaining thermal stability and extending the operational range of the light conversion device.
Implementation Method 1
a solder bond disposed on the metal heat sink, attaching the optoceramic phosphor element to the metal heat sink
Implementation Method 2
The phosphor is energized, or 'pumped' by a laser or other pump light source to emit phosphorescence
Data Source
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AI summary
A light generator comprises a light conversion device (10) and a light source (18) arranged to apply a light beam (L) to a light conversion element (20). The light conversion device (10) includes: an optoceramic (20) or other solid phosphor element comprising one or more phosphors embedded in a ceramic, glass, or other host; a metal heat sink (12); and a solder bond (40) attaching the optoceramic phosphor element (20) to the metal heat sink (12). The optoceramic phosphor element (20) does not undergo cracking in response to the light source (18) applying a light beam (L) of beam energy effective to heat the optoceramic phosphor element (20) to the phosphor quenching point.