Optocoupler Lead Frame Layout for Precise Chip Alignment
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Solution Overview
Problem
Conventional optocouplers face issues with inconsistent current transfer ratio (CTR) due to deviations in the opposed positions of light-emitting and light-sensing chips, leading to increased manufacturing costs and reduced production efficiency, as they require different lead frames and equipment for each type of chip.
Innovation Solution
A lead frame design with two functional parts per frame unit, allowing for precise positioning and alignment of both light-emitting and light-sensing chips, using the same structure for both types of chips, which reduces manufacturing costs and improves production efficiency by enabling the use of the same equipment for both chip types.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different lead frames with different structures are used for light-emitting chip and light-sensing chip, then the chips can be accommodated, but the opposed positions are more likely to be deviated and manufacturing costs significantly increase
Solution Approach 1:
The lead frame is designed with frame units that can accommodate both light-emitting chips and light-sensing chips using the same structural design. Each frame unit includes functional parts that are identical in structure for both chip types, allowing the same lead frame to serve multiple functions and eliminate the need for different lead frames for different chip types.
Solution Approach 2:
The lead frame is divided into multiple frame units, with each frame unit containing functional parts for mounting chips. This segmentation allows for precise positioning and alignment of chips within each frame unit while maintaining the overall structure's ability to accommodate different chip types through standardized functional parts.
2Adaptability or versatility
If different lead frames with different structures are used for light-emitting chip and light-sensing chip, then the chips can be accommodated, but manufacturing costs significantly increase due to separate mold development
Solution Approach 1:
The lead frame is designed with frame units that can accommodate both light-emitting chips and light-sensing chips using the same structural design. Each frame unit includes functional parts that are identical in structure for both chip types, allowing the same lead frame to serve multiple functions and eliminate the need for different lead frames for different chip types.
3Ease of operation
If different machines are used to operate at different work stations for placing and bonding the two types of chips, then the chips can be processed, but the costs of equipment and personnel increase and production efficiency is reduced
Solution Approach 1:
The lead frame is designed with frame units that can accommodate both light-emitting chips and light-sensing chips using the same structural design. Each frame unit includes functional parts that are identical in structure for both chip types, allowing the same lead frame to serve multiple functions and eliminate the need for different lead frames for different chip types.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures precise alignment and reduced deviations between the chips, resulting in improved CTR consistency and reduced manufacturing costs, enhancing product yield and competitiveness.
Implementation Method 1
the light-emitting chip, such as an infrared light-emitting diode, will emit infrared light
Implementation Method 2
the light-sensing chip at a receiving terminal will generate an induced current after receiving the infrared light
Data Source
AI summary
A lead frame for an optocoupler is provided, which is a metal sheet and includes multiple frame units and multiple mutually parallel connecting strips. The frame units are arranged at intervals on each of the connecting strips. Each of the frame units includes two adjacent functional parts, and two pins perpendicularly connected to the connecting strip. The two functional parts are both located on one side of the connecting strip and are respectively connected to the two pins and ends of the two pins are located on the other side of the connecting strip. The area of each of the functional parts is sufficient to accommodate a chip to be installed and fixed, and the chip is any one of a light-emitting chip and a light-sensing chip.