Opto-Electric Module Heat Dissipation via Multi-Stage Segmentation
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Solution Overview
Problem
Existing optical modules struggle to efficiently dissipate heat generated by the opto-electric converter, which affects its operability and requires improved heat dissipation properties.
Innovation Solution
The opto-electric transmission composite module includes an opto-electric hybrid board, a printed wiring board, a heat dissipating member, and a metal casing. The heat dissipating member is in contact with the casing and the printed wiring board, allowing for efficient heat release from the opto-electric conversion portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipating sheet is used to release heat from opto-electric converter, then heat dissipation is achieved, but heat dissipation efficiency is insufficient
Solution Approach 1:
The heat dissipation path is segmented into multiple stages: heat dissipating sheet (first heat dissipation), printed wiring board (second heat dissipation), and casing (third heat dissipation). This multi-stage segmentation allows heat to be progressively dissipated through different materials and paths, improving overall heat dissipation efficiency while protecting the opto-electric converter's operability.
Solution Approach 2:
The printed wiring board serves dual functions: electrical connection and heat dissipation. By making the printed wiring board possess heat dissipation capabilities in addition to its electrical function, the system achieves more efficient heat removal without adding separate components, thereby improving heat dissipation efficiency while maintaining the converter's reliability.
2Temperature
If heat dissipating member contacts both casing and printed wiring board, then heat dissipation efficiency improves, but structural complexity increases
Solution Approach 1:
The heat dissipating member is integrated into the existing printed wiring board structure, making the PCB serve both electrical and thermal management functions. This multi-functionality approach improves heat dissipation efficiency without significantly increasing structural complexity, as it utilizes existing components rather than adding separate dedicated heat dissipation structures.
Solution Approach 2:
The heat dissipating member combines the functions of thermal interface material and structural support element. By merging these functions into a single integrated component that contacts both the casing and printed wiring board, the design achieves efficient heat transfer paths while avoiding the complexity of multiple separate components and assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient heat dissipation from the opto-electric conversion portion, improving its operability and ensuring effective heat release to the casing.
Implementation Method 1
the heat dissipating member is in contact with the first wall and the printed wiring board, it is possible to efficiently release heat which is generated in the opto-electric conversion portion and reaches the heat dissipating member through the opto-electric hybrid board and the printed wiring board to the first wall
Data Source
AI summary
Provided is an opto-electric transmission composite module capable of efficiently dissipating heat of an opto-electric conversion portion, which includes an opto-electric hybrid board configured to be optically and electrically connected to an opto-electric conversion portion and including an optical waveguide and an electric circuit board in order toward one side in a thickness direction; a printed wiring board electrically connected to the electric circuit board; a heat dissipating layer; and a casing made of metal, the casing accommodating the opto-electric hybrid board, the printed wiring board, and the heat dissipating member, the casing including a first wall are provided. The first wall, the heat dissipating layer, a portion of the printed wiring board, and the opto-electric hybrid board are disposed in order toward one side in the thickness direction. The heat dissipating layer is in contact with the first wall and the printed wiring board.