Optoelectronic Adapter Module for Form-Factor Compatibility

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Solution Overview

Problem

Existing optoelectronic modules with different form-factors are often incompatible with host devices due to mechanical, electrical, and thermal interface differences, limiting interoperability and preventing the use of cheaper modules with similar functionality in applications requiring higher bandwidth.

Innovation Solution

An adapter module with a body of one form-factor and multiple receptacles for optoelectronic modules of a second, smaller form-factor, including signal processing circuitry to adapt high-speed data signals and interfaces, allowing multiple smaller modules to be used in host devices designed for larger modules.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If host devices are designed with receptacles for larger form-factor optoelectronic modules, then mechanical interface compatibility is achieved, but the ability to use smaller form-factor modules is lost

Engineering Contradiction:

Improveform-factor compatibilityVSAvoidreceptacle design

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent introduces an adapter as an intermediary device that bridges the host device receptacle and smaller form-factor optoelectronic modules. The adapter contains a larger body that interfaces with the host device and multiple smaller receptacles that interface with the smaller modules, thereby enabling compatibility without modifying the host device or the modules themselves.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The adapter divides the interface function into multiple segments: the host interface section, the module interface sections, and the signal processing section. This segmentation allows each part to be optimized independently while working together to achieve form-factor adaptation.

Inventive Principle:

Principle #1Segmentation

2Productivity

If multiple smaller optoelectronic modules are used to achieve aggregate data rates, then cost-effectiveness and flexibility improve, but interface and thermal management complexity increases

Engineering Contradiction:

Improveaggregate data rateVSAvoidinterface and thermal management

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The adapter merges multiple electrical interfaces from smaller modules into a unified high-speed interface that connects to the host device. It combines parallel data lanes from multiple modules and performs signal processing to aggregate them into a single coherent signal stream, simplifying the interface complexity while maintaining high aggregate data rates.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The adapter acts as a thermal intermediary by providing a unified thermal interface to the host device while distributing thermal management to multiple smaller module interfaces. This allows the host device to manage thermal loads through a single interface while the adapter handles the distribution and dissipation across multiple smaller modules.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS8200097B2Optoelectronic module form-factor adapter

Publication Date: 2012.06.12 II VI DELAWARE INC

AI summary

In one example embodiment, an adapter module includes a body having a first form-factor and multiple receptacles extending into the body. Each of the receptacles is configured to receive an optoelectronic module having a second form-factor. The second form-factor is smaller than the first form-factor. The first form-factor may substantially conform to the CFP MSA, for example. The second form-factor may substantially conform to the SFP+ or QSFP MSA, for example.