Optoelectronic Module Adhesive Segmentation for Moisture Misalignment
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Solution Overview
Problem
Optoelectronic modules face issues with adhesive layers that increase the module's footprint and cause misalignment due to moisture absorption, particularly in thick adhesive layers, which affects the alignment of optical and active components.
Innovation Solution
The use of an intermediate substrate with optical and active optoelectronic components separated by gaps, where thin adhesive layers are strategically placed to prevent excess adhesive from reaching sensitive areas and include features like optical alignment spacers and venting channels to manage moisture and alignment, along with methods for precise alignment and curing of adhesives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a thick adhesive layer is used to provide reliable mechanical connection and electromagnetic radiation barrier, then the mechanical strength and shielding effectiveness are improved, but the module footprint increases and misalignment occurs due to moisture absorption
Solution Approach 1:
The patent divides the adhesive application into two distinct segments: a first adhesive layer applied to the optical housing portion and a second adhesive layer applied to the active optoelectronic component assembly. This segmentation allows each adhesive layer to be optimized independently - the first layer can be thicker for mechanical strength while the second layer is thinner to minimize footprint and moisture absorption, thereby resolving the contradiction between mechanical connection strength and module footprint.
2Strength
If a thick adhesive layer is used to provide reliable mechanical connection, then the mechanical strength is improved, but misalignment occurs due to moisture absorption
Solution Approach 1:
By segmenting the adhesive system into two layers with different thicknesses and positions, the patent prevents the misalignment caused by moisture absorption. The thinner second adhesive layer near the active component absorbs less moisture, maintaining alignment precision, while the first adhesive layer provides the necessary mechanical strength.
Solution Approach 2:
The patent introduces an intermediate substrate as a mediator between the optical housing portion and the active optoelectronic component assembly. This intermediate substrate, combined with the segmented adhesive layers, acts as a buffer that maintains precise alignment while still providing mechanical connection, thereby resolving the contradiction between strength and alignment precision.
3Object-affected harmful factors
If adhesive is used to provide electromagnetic radiation barrier, then the shielding effectiveness is improved, but the module footprint increases due to adhesive overflow region
Solution Approach 1:
The patent applies adhesive with different properties and thicknesses at different locations. The first adhesive layer near the optical housing is optimized for electromagnetic radiation shielding, while the second adhesive layer near the active component is made thinner to minimize footprint. This local differentiation of adhesive quality allows effective shielding without increasing the overall module footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes the module's footprint, prevents misalignment, and effectively contains adhesives, ensuring precise alignment and durability by controlling moisture absorption and stray light, while allowing for efficient electrical communication and reduced thickness.
Implementation Method 1
the adhesive layer can absorb moisture after curing which tends to result in expansion
Implementation Method 2
The optical assembly includes at least one optical element, such as a diffractive or diffractive optical element, or a microlens array
Implementation Method 3
The optical assembly includes at least one optical element, such as a diffractive or diffractive optical element
Data Source
AI summary
Optoelectronic modules, such as imaging cameras, proximity sensors, range cameras, structured-light/pattern generators, and image projectors, and methods for their manufacture, are disclosed. The optoelectronic modules exhibit particularly small dimensions. The optoelectronic modules include an optical assembly, an intermediate substrate, and a base substrate. The optical assembly includes a flange portion. An adhesive layer between the flange portion and the intermediate substrate, and an additional adhesive layer between the intermediate substrate and the base can be substantially non-transmissive to light and can resist dimensional changes dues to moisture absorption, for example.


