Optoelectronic Component Array Assembly for Uniform Radiation Output

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Solution Overview

Problem

The assembly of optoelectronic semiconductor components with small lateral extents is challenging due to high placement accuracy requirements and the difficulty in achieving uniform radiation behavior without tilt during mounting.

Innovation Solution

The arrangement involves mounting optoelectronic semiconductor components with radiation outlet sides free of contact structures on a carrier, followed by electrical contacting through connection structures, allowing for simplified assembly and reduced tilt during mounting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If optoelectronic semiconductor components with small lateral extents are assembled, then the device density and integration are improved, but the placement accuracy requirements and difficulty of assembly increase

Engineering Contradiction:

Improvelateral extent of semiconductor componentsVSAvoidplacement accuracy

Core Design Contradiction:

Area of moving objectVSManufacturing precision

Solution Approach 1:

A carrier is introduced as an intermediary component to hold multiple semiconductor components during assembly. The carrier provides a stable platform with defined positioning features that simplify the placement process and reduce the precision requirements for direct component-to-component positioning.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The assembly process is segmented into stages: first mounting components on a carrier, then electrically contacting them through connection structures. This segmentation allows each stage to be optimized independently, reducing overall assembly difficulty.

Inventive Principle:

Principle #1Segmentation

2Ease of manufacture

If optoelectronic semiconductor components are mounted on a carrier, then the ease of assembly is improved, but the complexity of the mounting structure increases

Engineering Contradiction:

Improveease of assemblyVSAvoidmounting structure complexity

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The carrier serves multiple functions: it provides mechanical support for components, defines their positions, and facilitates electrical contacting through integrated connection structures. This multi-functionality reduces the need for separate mounting and contacting structures.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The mounting structure and electrical connection structures are merged into a single integrated carrier system. This combination simplifies the overall structure by eliminating the need for separate mounting and electrical connection components.

Inventive Principle:

Principle #5Merging (Combining)

3Ease of manufacture

If contact structures are placed on the radiation outlet side of semiconductor components, then the electrical contacting is simplified, but the radiation coupling is impeded

Engineering Contradiction:

Improveelectrical contacting simplicityVSAvoidradiation coupling efficiency

Core Design Contradiction:

Ease of manufactureVSIllumination intensity

Solution Approach 1:

Instead of placing contact structures on the radiation outlet side, the approach is inverted: components are mounted on a carrier with contact structures positioned on the opposite side from the radiation outlet, allowing both electrical contacting and radiation coupling to occur without interference.

Inventive Principle:

Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables efficient and accurate assembly of optoelectronic semiconductor components with small lateral extents, ensuring uniform radiation behavior and improved contrast between adjacent components.

Implementation Method 1

The optoelectronic semiconductor components each comprise a semiconductor body, with an active region arranged to emit electromagnetic radiation... The active region preferably comprises a pn junction, a double heterostructure, a single quantum well (SQW) structure, or a multi-quantum well (MQW) structure for radiation generation.

Methodology Applied

Scientific EffectElectroluminescence: Electroluminescence

Implementation Method 2

The insulation layer is designed to be absorbing or reflecting for radiation generated in the active region. In particular, the insulation layer is designed to be absorbent or reflective for visible electromagnetic radiation.

Methodology Applied

Scientific EffectAbsorption of electromagnetic radiation: Absorption (EM radiation)

Data Source

PatentUS20250126953A1Arrangement having semiconductor components that emit electromagnetic radiation and production method therefor

Publication Date: 2025.04.17 OSRAM OPTO SEMICON GMBH & CO OHG

AI summary

In an embodiment an arrangement includes a plurality of optoelectronic semiconductor components arranged in a common plane, wherein each semiconductor component is laterally delimited by side faces, and wherein each semiconductor component has a semiconductor body with an active region configured to emit electromagnetic radiation, a radiation outlet side configured to couple out the electromagnetic radiation, a rear face opposite to the radiation outlet side, and a contact structure arranged on the rear face. The arrangement further includes an output element, an electrically insulating insulation layer and an electrical connection structure, wherein the insulation layer is arranged between side faces of adjacent semiconductor components and is absorbent or reflective of the electromagnetic radiation.