Optoelectronic Assembly Thermal Management via Direct PCB Coupling
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Solution Overview
Problem
Conventional optoelectronic assemblies face challenges with complex and costly soldering processes for wire connections and high thermal resistance due to multiple adhesive bonding layers, which impede efficient heat dissipation and increase production costs.
Innovation Solution
The optoelectronic assembly design eliminates the holding body by directly coupling the carrier element to the printed circuit board, using a single adhesive layer for heat dissipation and incorporating a contact element with a U-shape or spring design to facilitate secure electrical connections without soldering, thereby simplifying production and enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If multiple adhesive bonding layers are used to connect carrier element and printed circuit board, then mechanical stability is improved, but thermal resistance increases and heat dissipation deteriorates
Solution Approach 1:
The patent merges the mechanical connection function and thermal conduction function into a single adhesive layer. Instead of using multiple adhesive layers for mechanical stability and separate thermal pathways, the invention uses one adhesive layer that simultaneously provides mechanical bonding and thermal conduction, thereby reducing thermal resistance while maintaining mechanical stability.
Solution Approach 2:
The adhesive layer is designed to perform multiple functions: mechanical bonding between the carrier element and printed circuit board, and thermal conduction for heat dissipation. This multi-functional adhesive layer eliminates the need for separate thermal management components and reduces overall thermal resistance in the assembly.
2Reliability
If insulated wires are soldered to connect contact locations, then electrical connection reliability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The invention extracts and eliminates the insulated wires from the assembly. Instead of using wire connections that require soldering, the patent uses direct electrical contact through contact locations on the carrier element that are electrically connected to the printed circuit board without intermediate wiring, thereby simplifying manufacturing while maintaining electrical connection reliability.
Solution Approach 2:
The patent replaces the mechanical soldering process with a direct electrical contact system. The contact locations on the carrier element are designed to make direct electrical contact with the printed circuit board, eliminating the need for soldering operations and reducing manufacturing complexity while ensuring reliable electrical connections.
3Reliability
If insulated wires are used for electrical connections, then electrical connectivity is achieved, but production cost increases
Solution Approach 1:
The invention removes the expensive insulated wires from the assembly. The electrical connectivity is achieved directly through contact locations on the carrier element that interface with the printed circuit board, eliminating the need for wire materials and associated manufacturing costs while maintaining reliable electrical connections.
Solution Approach 2:
The patent uses simple, cost-effective contact locations that are integrated into the carrier element and printed circuit board assembly. These direct contact points replace expensive insulated wires, significantly reducing material costs and manufacturing expenses while ensuring functional electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies and cost-reduces the production of optoelectronic assemblies by eliminating unnecessary components and adhesive layers, ensuring effective heat dissipation and secure electrical connections, even under thermal expansion.
Implementation Method 1
The adhesive layer and the printed circuit board form a thermal coupling between the carrier element and the printed circuit board
Implementation Method 2
at least one contact element (46, 48) is arranged on an inner side of the housing body (14) and is formed in such a way that the contact element (46, 48) electrically couples the contact location (30, 32) of the carrier element (11) to the connection location (38, 40) of the printed circuit board (12)
Data Source
AI summary
Various embodiments may relate to an optoelectronic assembly, including a printed circuit board, which has a first and a second sides, a central cutout, at least one contact cutout and, at least one connection location, a carrier element coupled to the printed circuit board, has a first side and at least one contact location, at least one optoelectronic component arranged on the first side of the carrier element in such a way that it is exposed in the central cutout of the printed circuit board, a housing body, which has a central cutout and which is formed and physically coupled to the printed circuit board such that the optoelectronic component is exposed in the central cutout, and at least one contact element arranged on an inner side of the housing body is formed such that the contact element electrically couples the contact location of the carrier element to the connection location.