Opto-electronic Assembly Multi-level Mounting Plate
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Solution Overview
Problem
Existing high-speed optoelectronic assemblies face challenges in achieving high-frequency performance due to mechanical stress from thermal expansion mismatches and limited RF-performance caused by wirebond connections across height differences, especially in parallel optical transmission systems with close spacing of RF channels leading to crosstalk and signal degradation.
Innovation Solution
The proposed solution involves a mounting plate with optimized electrical lines and micro-mirror components, where transducer components are mounted with submounts to align their top surfaces with electronic integrated circuits, allowing short and flat wirebond connections, and a micro-mirror component positioned above to reflect optical paths parallel to the surface, ensuring proper optical coupling and minimizing mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If transducer components are mounted directly on a flat mounting plate, then assembly is simple, but wirebond connections must span height differences causing limited RF-performance
Solution Approach 1:
The mounting plate is segmented into different height levels (first level for transducer components, second level for electronic integrated circuits). This segmentation allows each component type to be mounted at its optimal height, eliminating the need for wirebonds to span height differences and improving RF-performance while maintaining assembly simplicity.
Solution Approach 2:
The solution transitions from a two-dimensional flat mounting surface to a three-dimensional multi-level structure. By utilizing the vertical dimension to create different mounting levels, the patent resolves the contradiction between assembly simplicity and RF-performance, allowing short flat wirebond connections on the same level while maintaining structural organization.
2Ease of operation
If optical ports are positioned far from transducer chips, then optical coupling is easier, but mechanical stress from thermal expansion increases
Solution Approach 1:
The optical coupling function is segmented from the transducer chip itself and assigned to a separate optical component mounted on the mounting plate. This allows the optical port to be positioned at an optimal distance for coupling while the transducer chip remains close to its electrical connections, reducing thermal expansion stress on the chip while maintaining ease of optical coupling.
3Productivity
If RF channels are closely spaced to increase transmission capacity, then transmission capacity increases, but crosstalk and signal degradation occur
Solution Approach 1:
By mounting both transducer components and electronic integrated circuits on the same height level (second level), the patent creates an equipotential plane for electrical connections. This reduces impedance variations and signal reflections that cause crosstalk, allowing closely spaced RF channels to maintain signal quality while achieving high transmission capacity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances high-frequency performance by reducing mechanical stress and improving signal transmission efficiency, enabling compact and efficient high-speed optoelectronic assemblies with superior RF-characteristics for both transmitter and receiver subassemblies.
Implementation Method 1
a micro-mirror component positioned above to reflect optical paths parallel to the surface, ensuring proper optical coupling
Data Source
AI summary
An opto-electronic assembly for high speed opto-electronic signal transmission which comprises:mounting plate with a top side; wherein the top side contains at least one area at a higher level and at least one area at a lower level,an electro-optical or opto-electronic transducer component with a number of transducers with the optical port of the transducer component on the top side;a micro-mirror component;an optical transmission path assigned to each transducer wherein the transmission axis of each transmission path is oriented substantially parallel to the surface of the transducer component and to the top side of the mounting plate; anda transducer component that is mounted with the bottom side on the mounting plate below a micro-mirror component that is mounted above the transducer component in such a configuration that the optical transmission path to or from each transducer is reflected at the dedicated mirror surface.