Optoelectronic Semiconductor Component Beveled Side Faces
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Solution Overview
Problem
Conventional optoelectronic semiconductor components face challenges in producing radiation-transmissive encapsulating bodies with precise shapes and small tolerances, making it difficult to adjust the position of semiconductor chips and efficiently outcouple electromagnetic radiation.
Innovation Solution
The optoelectronic semiconductor component features a radiation-transmissive body with beveled or sloping side faces produced by a singulation process, such as sawing, which allows for easier adjustment and increased outcoupling efficiency of electromagnetic radiation, and a connection carrier with ceramic material and conductive tracks for precise electrical contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional encapsulating methods using molds are used to produce radiation-transmissive bodies, then the encapsulating body can be produced, but it is difficult to achieve precise shapes and small tolerances, and adjustment of semiconductor chip position is complicated
Solution Approach 1:
The patent applies preliminary action by pre-defining the position of the semiconductor chip on the connection carrier before encapsulation. The chip is fixed at a predetermined location with predetermined orientation, and the encapsulating body is subsequently formed to match this pre-established configuration. This eliminates the need for complex post-encapsulation adjustments and simplifies the overall manufacturing process while maintaining precise positioning.
2Productivity
If conventional perpendicular side faces are used in radiation-transmissive bodies, then the structure is simple to produce, but the outcoupling efficiency of electromagnetic radiation is reduced
Solution Approach 1:
The patent applies asymmetry by replacing the conventional symmetric perpendicular side faces with asymmetric sloping side faces. The side faces are inclined at angles between 5° and 45° relative to the perpendicular direction, creating an asymmetric geometry that optimizes the outcoupling of electromagnetic radiation. This asymmetric design redirects light paths to reduce total internal reflection and improve extraction efficiency, while the specific angle ranges maintain manufacturability through standard sawing or grinding processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the outcoupling efficiency of electromagnetic radiation by up to 13% compared to traditional perpendicular side faces, simplifies the production process, and reduces costs associated with modifying molds and maintaining small tolerances.
Implementation Method 1
The radiation-transmissive body is in this case transmissive at least for some of the electromagnetic radiation generated by the semiconductor chip when in operation
Implementation Method 2
the radiation-transmissive body comprises at least one bevelled or sloping side face... the radiation-transmissive body is thus not cuboidal in configuration, but rather has at least one bevelled side face
Data Source
AI summary
An optoelectronic semiconductor component comprising a connection carrier with a mounting face and an electrically insulating base member. An optoelectronic semiconductor chip is arranged on the mounting face of the connection carrier. A radiation-transmissive body having four side faces is provided. The radiation-transmissive body surrounds the semiconductor chip in such a way that the radiation-transmissive body envelops outer faces of the optoelectronic semiconductor chip not facing the connection carrier in form-fitting manner. The radiation-transmissive body comprises at least one side face which extends at least in places at an angle of between 60° and 70° to the mounting face. The base member has a thickness which amounts to at most 250 μm.