Optoelectronic Bonding Layer Cavities for Low-Temperature Sealing
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Solution Overview
Problem
Existing assembly processes for optoelectronic devices, such as SiOx/SiOx bonding and UV-activated organic adhesive bonding, degrade temperature-sensitive components like color conversion modules and transistors due to high temperatures or unsatisfactory mechanical properties, compromising device reliability and compatibility with microelectronic manufacturing processes.
Innovation Solution
A low-temperature inorganic bonding material with cavities is used between a transparent support layer and an emitting layer, preserving temperature-sensitive structures by maintaining mechanical strength and optical transmission, and allowing hermetic sealing to protect against oxidation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If SiOx/SiOx bonding is used to assemble transparent support layer, then bonding strength and hermetic sealing are improved, but consolidation annealing at high temperature degrades color conversion modules and electronic components
Solution Approach 1:
The bonding layer is segmented into multiple regions: hermetic sealing regions with inorganic bonding material for strong sealing, and transparent regions with removed inorganic material to allow light transmission. This segmentation enables the bonding layer to simultaneously provide mechanical strength and optical transparency without requiring high-temperature annealing that would damage sensitive components.
Solution Approach 2:
The invention changes the bonding temperature parameter from high temperature (200°C for 2 hours consolidation annealing) to low temperature processing. The inorganic bonding material is deposited and cured at temperatures below 150°C, preserving temperature-sensitive color conversion modules and electronic components while still achieving adequate bonding strength.
2Ease of manufacture
If transparent organic adhesive bonding layer is used, then assembly process is simplified, but mechanical properties are unsatisfactory and expansion/deformation problems occur
Solution Approach 1:
The invention uses a thin inorganic bonding material layer (few nanometers to micrometers thick) that provides sufficient bonding strength without requiring the thickness and complexity of organic adhesive layers. This thin inorganic layer is easier to control and provides better mechanical properties while maintaining manufacturing simplicity.
3Ease of manufacture
If transparent organic adhesive bonding layer is used, then assembly is easier, but color conversion modules are exposed to oxygen reducing their lifespan
Solution Approach 1:
The inorganic bonding material creates an oxygen-barrier hermetic sealing layer that protects color conversion modules from oxidation and degradation. By forming continuous inorganic bonding regions that seal the device structure, the invention creates a protected internal environment that extends the lifespan of oxygen-sensitive components while maintaining manufacturing ease.
4Strength
If inorganic bonding material is used, then bonding strength is improved, but optical transmission is blocked
Solution Approach 1:
The bonding layer is divided into hermetic sealing regions containing inorganic bonding material for strength and sealing, and transparent regions where inorganic material is removed to allow light transmission. This spatial segmentation resolves the contradiction by providing both functions in different locations within the same bonding layer structure.
Solution Approach 2:
Different regions of the bonding layer have different properties: hermetic sealing regions have high density and opacity for strength and sealing, while transparent regions have removed inorganic material to provide optical clarity. This local differentiation of material properties allows the bonding layer to simultaneously satisfy conflicting requirements for strength and transparency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances device reliability, compatibility with microelectronic manufacturing, and extends the lifespan of sensitive components by preventing exposure to high temperatures and oxidizing environments.
Implementation Method 1
a low-temperature inorganic bonding material... preserving temperature-sensitive structures by maintaining mechanical strength
Implementation Method 2
the bonding layer includes cavities directly above the optically active structures... allowing hermetic sealing to protect against oxidation
Implementation Method 3
allowing hermetic sealing to protect against oxidation... preventing exposure to high temperatures and oxidizing environments
Data Source
Figure 1A~2
Figure 3~4B
Figure 5~6
AI summary
The invention relates to an optoelectronic device comprising, stacked along a given direction z: - an emitting layer (2) comprising optically active structures configured to emit or receive radiation, - a sensitive layer (3) comprising at least one structure (31, 32, 33) exhibiting a temperature resistance below a maximum temperature (Tmax) of less than 200°C, - a bonding layer (4), - a transparent support layer (5). The bonding layer (4) is based on an inorganic low-temperature bonding material. The bonding layer (4) also includes cavities (40) located directly above the optically active structures, between the transparent support layer (5) and the emitting layer (2). The invention also relates to a method for manufacturing such an optoelectronic device.