Optoelectronic Semiconductor Carrier With Thin Ceramic Insulation
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Solution Overview
Problem
Existing optoelectronic semiconductor components face challenges in achieving low thermal resistance and efficient heat dissipation while maintaining mechanical rigidity and electrical insulation, particularly in applications like automotive headlamps where high thermal conductivity and efficient heat spread are crucial.
Innovation Solution
The optoelectronic semiconductor component features a carrier with a metal core accounting for at least 60% of its thickness, coated with a thin ceramic layer and further coated with a metal layer, which provides electrical insulation and thermal conductivity, allowing for efficient heat dissipation and mechanical stability. The carrier is formed from multiple parts connected via a potting body, ensuring all undersides end flush and the semiconductor chips are connected in series with insulated electrical connection surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thick ceramic layer is used to provide electrical insulation, then electrical insulation is improved, but thermal resistance increases and heat dissipation worsens
Solution Approach 1:
The patent changes the thickness parameter of the ceramic layer from conventional thick designs to a thin layer of at most 100 μm. This parameter change maintains sufficient electrical insulation while dramatically reducing thermal resistance, enabling efficient heat dissipation from the semiconductor chips through the carrier to the mounting surface.
Solution Approach 2:
The patent creates a composite carrier structure combining metal core material with ceramic coating. The metal provides high thermal conductivity for heat dissipation, while the thin ceramic layer provides electrical insulation. This composite approach resolves the contradiction by leveraging the complementary properties of both materials in a integrated structure.
2Temperature
If a metal core with high thermal conductivity is used, then heat dissipation is improved, but mechanical rigidity may be compromised without sufficient structural support
Solution Approach 1:
The patent employs a composite carrier consisting of a metal core with ceramic coating. The metal core (at least 60% of carrier thickness) provides high thermal conductivity for efficient heat dissipation, while the ceramic layer contributes to mechanical strength and rigidity. This composite structure allows the metal to handle thermal demands while the ceramic reinforces mechanical properties.
Solution Approach 2:
The patent applies different material properties to different regions of the carrier. The metal core accounts for at least 60% of the carrier thickness and provides the primary thermal conduction path, while the ceramic coating (at most 100 μm thick) provides electrical insulation and mechanical reinforcement where needed. This local differentiation of material properties optimizes both thermal and mechanical performance.
3Adaptability or versatility
If the carrier is formed from multiple carrier parts, then manufacturing flexibility and adaptability are improved, but device complexity increases
Solution Approach 1:
The patent divides the carrier into multiple separate carrier parts, each with its own metal core and ceramic coating. These parts can be manufactured independently using standardized processes, then assembled together with potting bodies to form the complete carrier structure. This segmentation enables flexible manufacturing and adaptation to different semiconductor chip configurations while maintaining relatively simple individual component designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves high thermal conductivity and efficient heat spread between semiconductor chips and an external mounting surface, while maintaining mechanical integrity and electrical insulation, enabling cost-effective and efficient production with high sawing speeds and adaptable thermal expansion coefficients.
Implementation Method 1
the metal core is directly coated with a ceramic layer having a thickness of at most 100 μm... achieves high thermal conductivity and efficient heat spread between semiconductor chips and an external mounting surface
Implementation Method 2
the metal core is directly coated with a ceramic layer having a thickness of at most 100 μm... maintaining electrical insulation
Implementation Method 3
the ceramic layer is directly coated in places with a metal layer, the semiconductor chips connect electrically to the contact pads via the metal layer
Data Source
AI summary
An optoelectronic semiconductor component includes a carrier having a carrier top side and an opposing carrier underside, wherein the carrier top sides each have a larger area than the associated carrier undersides, the carrier parts fixedly connect to one another via at least one potting body and the potting body together with the carrier parts represents a bearing component of the semiconductor component so that all carrier undersides end flush with the potting body, the light-emitting semiconductor chips electrically connect in series, the metal layer on the carrier top side is structured into conductor tracks and into electrical connection surfaces, and the electrical connection surfaces on the carrier top side are electrically insulated from the associated carrier underside so that the carrier underside of the carrier part the semiconductor chips are arranged on is potential-free and is completely covered with the metal layer.