Optoelectronic Component Carrier Segmentation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optoelectronic semiconductor components face challenges in achieving high mechanical stability and cost-effective manufacturing, particularly in miniature designs that eliminate the need for bonding wires and reduce manufacturing costs while maintaining mechanical stability.
Innovation Solution
The optoelectronic semiconductor component features a semiconductor body with a carrier that is electrically conductive and divided into two carrier bodies, providing external contacts for both polarities without the need for through-connections, and is designed with a multilayer structure for enhanced mechanical stability and heat dissipation, using a method that includes epitaxial semiconductor layer production and a carrier composite with isolation trenches for insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If through-connections are used in the carrier for electrical contacting, then electrical connectivity is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The carrier is divided into two separate carrier bodies (first carrier body and second carrier body) that are electrically insulated from each other. Each carrier body provides electrical contact for one polarity, eliminating the need for through-connections while maintaining electrical functionality. This segmentation resolves the contradiction by simplifying manufacturing (no through-holes needed) while achieving the required electrical connectivity.
2Ease of manufacture
If bonding wires are used for electrical contacting, then electrical connectivity is achieved, but manufacturing cost and process complexity increase
Solution Approach 1:
The electrical contacting function is merged into the carrier structure itself. The carrier bodies directly provide electrical contact through their conductive material, combining the support function and electrical contact function into a single integrated component. This eliminates the need for separate bonding wire steps, reducing manufacturing cost and process complexity while maintaining electrical connectivity.
3Reliability
If the carrier is divided into separate carrier bodies, then electrical insulation between polarities is achieved, but mechanical stability may be reduced
Solution Approach 1:
An electrically insulating material is introduced as an intermediary between the first and second carrier bodies. This insulating material fills the space between the separated carrier bodies, providing both electrical insulation and mechanical coupling. The intermediary resolves the contradiction by ensuring electrical isolation while maintaining the mechanical integrity and stability of the overall carrier structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves high mechanical stability, efficient heat dissipation, and cost-effective production by eliminating the need for bonding wires and reducing manufacturing complexity, while allowing for flexible contact placement and efficient radiation management.
Implementation Method 1
The semiconductor body comprises a semiconductor layer sequence, particularly epitaxially, which has been produced by means of MOCVD or MBE, for example
Implementation Method 2
the active region is provided for generating and/or receiving radiation
Implementation Method 3
The carrier is electrically conductive... efficient heat dissipation
Data Source
AI summary
What is specified is: an optoelectronic semiconductor component (1) comprising a carrier (5) and a semiconductor body (2), wherein the semiconductor body is fastened on the carrier and has a semiconductor layer sequence having an active region (20) provided for generating and/or receiving radiation, a first semiconductor layer (21) and a second semiconductor layer (22). The active region is arranged between the first semiconductor layer and the second semiconductor layer. The carrier is electrically conductive and is divided into a first carrier body (51) and a second carrier body (52), wherein the first carrier body and the second carrier body are electrically insulated from one another. The first carrier body has a first external contact (61) of the semiconductor component on the side remote from the semiconductor body, wherein the first contact is electrically conductively connected to the first semiconductor layer via the first carrier body. The second carrier body has a second external contact (62) of the semiconductor component on the side remote from the semiconductor body, wherein the second contact is electrically conductively connected to the second semiconductor layer via the second carrier body. The invention furthermore relates to a method for producing semiconductor components.