Optoelectronic Component Cavity Embedding for Compact Protection
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Solution Overview
Problem
Existing methods for producing optoelectronic components, such as LED components, face challenges in achieving compact external dimensions and cost-effective production while ensuring proper protection and electrical contacting of semiconductor chips.
Innovation Solution
A method involving arranging an optoelectronic semiconductor chip and a reflector on a carrier film, embedding them with potting material into a molded body, and forming a cavity to house the chip, where the reflector guides electromagnetic radiation out and allows for electrical contacting by uncovering chip surfaces and using metallization for soldering contact pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the optoelectronic semiconductor chip is embedded directly into a molded body with front and rear sides left uncovered, then the external dimensions are very compact, but the chip lacks protection against damage from external influences
Solution Approach 1:
The patent embeds the optoelectronic semiconductor chip within a cavity formed in the molded body, creating a nested structure where the chip is housed inside the molded housing. This nesting approach provides protection while maintaining compact external dimensions, as the molded body serves as a protective enclosure without significantly increasing the overall size.
Solution Approach 2:
The patent introduces a reflector as an intermediary element between the semiconductor chip and the external environment. The reflector serves multiple functions: it protects the chip from external influences, provides structural support, and optimizes light extraction. This intermediary structure enables both protection and compact design.
2Reliability
If the surface of the optoelectronic semiconductor chip facing away from the carrier film is covered during molded body formation, then the chip is protected, but additional covers are required which increase complexity
Solution Approach 1:
The molded body is designed to serve multiple functions simultaneously: it provides structural housing, protects the semiconductor chip from external influences, and eliminates the need for separate protective covers during formation. This multi-functionality reduces the number of additional components and simplifies the production process.
Solution Approach 2:
The patent merges the protective function with the molded body structure itself, combining what would traditionally be separate elements (housing and protective cover) into a single integrated component. This merging eliminates the need for additional covers and reduces production complexity.
3Ease of manufacture
If the reflector is uncovered on the rear side of the molded body, then electrical contacting is enabled, but the reflector is exposed to external influences
Solution Approach 1:
The patent applies local quality by selectively covering different regions of the reflector with different properties. The front side of the reflector is covered by the molded body for protection, while the rear side remains uncovered to enable electrical contacting. This localized differentiation allows both protection and electrical access without compromising either function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of optoelectronic components with very compact external dimensions and cost-effective implementation, ensuring protection of the semiconductor chip and facilitating precise alignment and electrical connections.
Implementation Method 1
The reflector may serve to reflect electromagnetic radiation, for example, visible light, emitted by the optoelectronic semiconductor chip and to guide it out of the optoelectronic component
Data Source
AI summary
A method for producing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment, the method includes arranging an optoelectronic semiconductor chip and a reflector on a top side of a carrier film, arranging a potting material in a region between the optoelectronic semiconductor chip and the reflector and forming a molded body, wherein the optoelectronic semiconductor chip, the reflector and the potting material are embedded into the molded body.