Optoelectronic Semiconductor Chip Lateral Anchoring Stability
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Solution Overview
Problem
Conventional optoelectronic components with semiconductor chips embedded in molding compounds suffer from inadequate stability due to poor adhesion between the semiconductor chip and the molding compound.
Innovation Solution
The optoelectronic semiconductor chip features a carrier with a semiconductor body having an active layer, a side surface with an anchoring structure, and a housing or optical element that engages laterally into this structure, enhancing stability by increasing the interface area between the chip and the housing or optical element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor chip is embedded into the molding compound, then the optoelectronic component is formed, but the adhesion between the molding compound and the semiconductor chip is poor resulting in inadequate stability
Solution Approach 1:
The patent transitions from conventional top-down embedding (where the chip is placed on the molding compound surface) to lateral anchoring (where the chip is secured from the side). The anchoring structure extends laterally from the semiconductor chip into the molding compound, creating a interlocking connection that prevents detachment. This dimensional change from vertical to lateral engagement fundamentally improves the adhesion and stability of the optoelectronic component.
Solution Approach 2:
The anchoring structure is divided into multiple segments or protrusions that extend laterally from the semiconductor chip. These segmented anchoring elements are distributed across the side surface of the chip, creating multiple discrete attachment points within the molding compound. This segmentation distributes the mechanical stress and enhances overall adhesion strength compared to a single continuous anchoring structure.
2Reliability
If the anchoring structure is formed on the side surface, then the mechanical stability is improved, but the structural complexity increases
Solution Approach 1:
The anchoring structure is integrated directly into the semiconductor chip substrate during the chip fabrication process, merging the anchoring function with the chip structure itself. This eliminates the need for separate anchoring components or additional assembly steps, as the chip body itself provides the anchoring features through laterally extending protrusions that are formed concurrently with the chip structure.
Data Source
AI summary
An optoelectronic semiconductor chip includes a carrier and a semiconductor body having an active layer that generates electromagnetic radiation, wherein the semiconductor body is arranged on the carrier, the semiconductor body has a first main surface facing away from the carrier and a second main surface facing the carrier, the semiconductor chip has a side surface having an anchoring structure, and the second main surface is arranged between the first main surface and the anchoring structure.