Optoelectronic Component With Integrated Chip for Scalable Light Control

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Solution Overview

Problem

Conventional solutions for optoelectronic components in the automotive sector require high circuit and wiring effort, and complex lighting applications necessitate increased programming effort, jeopardizing scalability, especially in multilayer boards.

Innovation Solution

An optoelectronic component with an encapsulated housing containing a control chip and multiple contact areas for electrical connection, allowing for flexible and scalable control of both integrated and external optoelectronic components, enabling a master-slave arrangement and adjustable current sources for programmable light emission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If conventional solutions with separate multi-channel drivers and complex wiring are used, then individual control of optoelectronic components is achieved, but circuit complexity and wiring effort increase significantly

Engineering Contradiction:
ImproveIndividual control capabilityVSAvoidCircuit complexity
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The patent merges the control chip and multiple optoelectronic components into a single integrated device. The control chip is housed within the same encapsulated housing as the optoelectronic components, eliminating the need for separate driver circuits and reducing wiring complexity while maintaining individual control capability through integrated contact areas.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated device serves multiple functions: it contains both the control chip for signal processing and multiple optoelectronic components for light emission. This multi-functional integration allows the device to replace both driver circuits and light sources, reducing overall system complexity while maintaining versatility.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If more optoelectronic components are integrated with individual control, then functionality and lighting patterns are enhanced, but programming effort and scalability are compromised

Engineering Contradiction:
ImproveLighting pattern functionalityVSAvoidProgramming effort
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The device segments control functionality into modular contact areas that can be individually addressed. Each contact area corresponds to specific optoelectronic components, allowing for simplified programming through standardized connection patterns while maintaining the ability to create complex lighting patterns through selective activation of different component groups.

Inventive Principle:
Principle #1Segmentation

3Ease of operation

If separate driver circuits are used for each optoelectronic component, then individual control is achieved, but the number of connections and wiring requirements increase

Engineering Contradiction:
ImproveIndividual control capabilityVSAvoidNumber of connections
Core Design Contradiction:
Ease of operationVSQuantity of substance

Solution Approach 1:

Multiple control connections are merged into a single integrated device housing. The control chip within the housing receives control signals and distributes them to multiple optoelectronic components internally, reducing the number of external connections required while maintaining individual control capability for each component.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS20240063355A1Optoelectronic component, luminescent assembly and mounting strap
Publication Date: 2024.02.22 AMS OSRAM INT GMBH
  • US20240063355A1 patent drawing
  • US20240063355A1 patent drawing
  • US20240063355A1 patent drawing

AI summary

The invention relates to an optoelectronic device comprising an encapsulated housing having a radiation region and an integrated control chip. At least one optoelectronic component integrated into the radiation region is provided, which is coupled to the integrated control chip for electrical control. A plurality of contact areas on at least one side of the encapsulated housing are partially electrically connected to the integrated control chip. At least a first and a second contact region of the plurality of contact regions are electrically connected to the integrated control chip and are each adapted to be electrically connected to an optoelectronic component disposed outside the housing. A first group of contact areas is adapted to receive control signals to the integrated control chip. A second group of contact areas has one contact area for a ground connection and one contact area for connecting a supply voltage for the integrated control chip.