Optoelectronic Chip Molding for Insulated Sidewall Encapsulation
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Solution Overview
Problem
Current methods for producing optoelectronic semiconductor components are complex and lack a simplified approach to encapsulating semiconductor chips with an electrically insulating molded body that does not contain conductive elements penetrating through it, while ensuring effective electrical and optical functionality.
Innovation Solution
A method involving a carrier with optoelectronic semiconductor chips, where a molded or shaped body is formed around the chips to cover their side areas, with optional plated-through holes and phosphor layers, allowing for electrical connections and optical reflectivity, and removing the carrier to expose the underside for radiation emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a molded body completely surrounds the semiconductor chip including the top surface, then mechanical stability and electrical insulation are improved, but optical functionality deteriorates due to blocking light emission
Solution Approach 1:
The molded body is segmented to cover only specific areas of the semiconductor chip (side surfaces and bottom) while leaving the light-emitting top surface exposed. This partial encapsulation approach maintains mechanical stability through side coverage while preserving optical functionality by excluding the emission area from encapsulation.
Solution Approach 2:
Different regions of the semiconductor chip receive different treatments: the side surfaces and bottom are covered by the molded body for mechanical support and electrical insulation, while the top emission surface remains exposed. This localized differentiation resolves the contradiction by applying encapsulation only where beneficial.
2Reliability
If conductive elements penetrate through the molded body to establish electrical connections, then electrical connectivity is improved, but the molded body loses its electrical insulation property
Solution Approach 1:
The electrical connection function is extracted from the molded body by using separate conductive elements (wire bonds or contact pads) that connect to the semiconductor chip without penetrating the molded body. The molded body maintains its insulating property while electrical connectivity is achieved through these external conductive paths.
Solution Approach 2:
Wire bonds or contact pads serve as intermediary elements between the semiconductor chip and external circuits. These intermediaries provide electrical connectivity without requiring the molded body to conduct electricity, thus preserving the molded body's insulating function while achieving reliable electrical connections.
3Stability of the object's composition
If the carrier is retained to provide structural support, then mechanical stability is improved, but the underside of the chip remains covered preventing radiation emission
Solution Approach 1:
The carrier provides mechanical support during the manufacturing and assembly process (preliminary support), but is removed before the final product is completed. This preliminary action allows the chip to be stabilized during production while ensuring the emission surface remains accessible in the final product.
Solution Approach 2:
The carrier is discarded after serving its temporary purpose of providing mechanical support during manufacturing. Its removal ensures that the underside of the chip is exposed for proper heat dissipation and does not block radiation emission, while the molded body continues to provide the necessary mechanical stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the production of optoelectronic semiconductor components by ensuring mechanical stability, electrical insulation, and optical reflectivity, while allowing for efficient heat dissipation and flexible assembly of multiple chips with similar emission characteristics, reducing costs and improving emission uniformity.
Implementation Method 1
a phosphor layer which absorbs electromagnetic radiation generated by the semiconductor chip during operation and converts the electromagnetic radiation into electromagnetic radiation in a different wavelength range than the semiconductor chip generates
Implementation Method 2
the shaped body is optically reflective
Data Source
AI summary
An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, at least one side area connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and a molded body, wherein the molded body surrounds the optoelectronic semiconductor chip at all side areas at least in places, the molded body is electrically insulating, and the molded body is free of any conductive element that completely penetrates the molded body.