Optoelectronic Chip Assembly with Substrate Opening to Reduce Air Expansion Pressure
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Solution Overview
Problem
Conventional integrated circuit packaging in optoelectronic devices faces issues with air expansion causing pressure forces that can damage the device, due to trapped air in the cavity formed by the cover and substrate, leading to potential detachment of optical elements or the cover from the substrate.
Innovation Solution
The integration of an electronic chip and optical element in a 'flip-chip' configuration within a support substrate with an opening, where the optical element is connected to the chip and substrate, forming a small cavity that minimizes air expansion forces, and using electrically conductive connections and underfill/molding resin to secure the components together.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional package structure with a cover and substrate is used, then the optical element can be positioned opposite to the optical components of the electronic chip, but a relatively large volume of air is trapped in the cavity which generates pressure force during temperature rises that can damage the case
Solution Approach 1:
The patent removes the traditional cover component from the package structure, extracting the source of the large air cavity volume. By eliminating the cover, the trapped air volume is dramatically reduced, thereby minimizing the pressure force generated during thermal expansion while maintaining the essential function of positioning the optical element opposite to the electronic chip components
Solution Approach 2:
The patent inverts the conventional packaging approach by eliminating the cover and directly integrating the optical element with the substrate. Instead of enclosing the chip in a covered cavity, the optical element is mounted directly on the substrate surface, fundamentally changing the structural arrangement to reduce air volume and thermal stress
2Reliability
If bonding wires are used to electrically connect the electronic chip to the substrate, then electrical connection is achieved, but the volume of the cavity must be large enough to contain the bonding wires
Solution Approach 1:
The patent replaces the mechanical bonding wire system with direct electrical connections integrated into the substrate. Instead of using physical wires that require space, the electrical connection is achieved through conductive traces or direct contact structures on the substrate surface, eliminating the need for a large cavity to accommodate bonding wires while maintaining reliable electrical connectivity
3Reliability
If a larger optical element is used, then the optical functions can be performed, but more materials are used during manufacturing increasing cost and size
Solution Approach 1:
The patent optimizes the dimensions and parameters of the optical element to achieve the minimum necessary size for performing optical functions. By carefully selecting the optical element size, shape, and positioning parameters, the design achieves functional performance with reduced material usage, lowering manufacturing costs and enabling a more compact package structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the risk of damage from air expansion forces, allows for a more compact and cost-effective design by using smaller optical elements and less material, and ensures reliable electrical and mechanical connections.
Implementation Method 1
The optical element allows carrying out one or more optical functions, such as a polarization, a filtering or a lensing effect, on the optical signal passing therethrough
Implementation Method 2
The optical element allows carrying out one or more optical functions, such as a polarization, a filtering or a lensing effect, on the optical signal passing therethrough
Implementation Method 3
The optical element allows carrying out one or more optical functions, such as a polarization, a filtering or a lensing effect, on the optical signal passing therethrough
Implementation Method 4
The electronic chip allows, for example, converting an optical signal into an electrical signal or an electrical signal into an optical signal
Implementation Method 5
a relatively large volume of air can be trapped in the cavity formed by the cover of the integrated circuit and can generate, during temperature rises, a pressure force by expansion of the trapped air
Implementation Method 6
the connection face of the optical element includes first solder elements soldered with complementary solder elements of the electronic chip, second solder elements soldered with complementary solder elements of the mounting face of the support substrate
Data Source
AI summary
An integrated circuit package includes an assembly of an electronic integrated circuit chip, an optical element and a support substrate. The support substrate includes a mounting face and has an opening sized and shaped to containing the electronic integrated circuit chip. The optical element includes a connection face connected to the mounting face of the support substrate and is positioned opposite to said opening. The electronic integrated circuit chip is connected to the connection face of the optical element such that the electronic chip is housed in said opening of the support substrate.