Optoelectronic Module Classification Clip for Single-Insertion Visibility
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Solution Overview
Problem
Optoelectronic modules, particularly SFP+ modules, face challenges in single-insertion applications where removal requires a separate tool, leading to potential misuse by end users due to the absence of visible indicators that identify characteristics like wavelength or data rate, which are obscured when inserted.
Innovation Solution
A classification clip with visible indicators is introduced to attach to the optoelectronic module, providing identification of characteristics and limiting the range of motion of optical connectors, while allowing for tool-assisted removal without a bail-actuated latch mechanism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a bail-actuated latch mechanism is eliminated from the optoelectronic module, then the module becomes suitable for single-insertion applications requiring tool-assisted removal, but the visible indicators that identify module characteristics are also eliminated
Solution Approach 1:
The invention separates the latch mechanism function from the indicator function. The classification clip serves solely as an indicator component that attaches to the module shell, while the latch mechanism is provided separately. This segmentation allows the indicator to remain visible and accessible even when the module is inserted into a cage without a bail-actuated latch mechanism.
Solution Approach 2:
The classification clip is designed to serve multiple purposes: it provides visible indicators of module characteristics (wavelength, data rate) and simultaneously acts as a retention component that works with the cage structure. The clip can be attached to various optoelectronic modules regardless of their specific latch mechanism type, making it a universal solution for single-insertion applications.
2Device complexity
If visible indicators are removed from the optoelectronic module, then the module structure is simplified, but the identification of characteristics such as wavelength or data rate becomes difficult when the module is inserted into a cage
Solution Approach 1:
The classification clip acts as an intermediary component that bridges the gap between the module's internal characteristics and external visibility requirements. It attaches to the module shell and provides visible indicators (colors, text, symbols) that communicate module characteristics without requiring the indicators to be integrated into the module's internal structure.
Solution Approach 2:
The classification clip utilizes color coding to indicate different module characteristics such as wavelength (e.g., different colors for 1310nm vs 1550nm) and data rate. This visual encoding system allows rapid identification of module specifications without requiring complex labeling or integrated displays, maintaining simplicity while improving detectability.
3Ease of operation
If a bail-actuated latch mechanism is used to facilitate tool-free removal, then ease of operation is improved, but the module cannot be used in single-insertion applications where tool-assisted removal is required
Solution Approach 1:
The retention system is designed to be dynamic and adaptable rather than fixed. The classification clip works with a tab mechanism on the cage that can be actuated by tools when needed. This dynamic system allows the same module-cage combination to serve both easy removal (when tab is accessible) and secure retention (when tool-assisted removal is required), providing versatility across different application scenarios.
Data Source
AI summary
A classification clip for an electronic or optoelectronic module. In one example embodiment, an optoelectronic module classification clip includes a body, a complementary structure attached to the body and configured to engage a complementary structure of a shell of an optoelectronic module, and a visible indicator included on at least a portion of the body or the complementary structure. The visible indicator indicates information concerning a characteristic of the optoelectronic module.


