Optoelectronic Component with Embedded Protection Diode
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Solution Overview
Problem
Existing optoelectronic components with semiconductor chips require mechanical stabilization and electrical contacting, necessitating compact and cost-effective solutions, while also needing protection against electrostatic discharges without external protection diodes.
Innovation Solution
An optoelectronic component with embedded pins and a protection diode within a molded body, where the pins electrically connect to the semiconductor chip contacts and the diode provides internal electrostatic discharge protection, eliminating the need for external diodes and ensuring mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external protection diodes are used, then electrostatic discharge protection is provided, but device complexity and component count increase
Solution Approach 1:
The patent combines the protection diode with the carrier body into a single integrated component. The protection diode is embedded within the molded body of the carrier, merging two previously separate components (carrier and external protection diode) into one unified structure. This eliminates the need for separate external protection diodes while maintaining electrostatic discharge protection functionality.
Solution Approach 2:
The carrier body is designed to serve multiple functions simultaneously: it provides mechanical stabilization for the thin-film chip, provides electrical contacting through embedded pins, and provides electrostatic discharge protection through the embedded protection diode. This multi-functional design eliminates the need for separate external protection components.
2Reliability
If multiple separate components are used for mechanical stabilization and electrical contacting, then functional requirements are met, but manufacturing cost and assembly complexity increase
Solution Approach 1:
The patent merges the carrier function with the protection diode function into a single integrated component. The molded body contains both the mechanical support structure and the embedded protection diode, eliminating the need for separate assembly steps and reducing manufacturing complexity.
Solution Approach 2:
The protection diode is pre-integrated into the carrier body during the molding process, before the actual assembly of the optoelectronic component. This preliminary integration of the protection diode into the carrier structure eliminates subsequent assembly steps and reduces overall manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, cost-effective optoelectronic component with reliable electrical connections and inherent protection against electrostatic discharges, enhancing production efficiency and reducing component size.
Implementation Method 1
a protection diode is embedded in the molded body and electrically conductively connects to the first contact and the second contact
Implementation Method 2
galvanically growing a first pin on the first electrical contact and a second pin on the second electrical contact
Data Source
AI summary
A method of producing an optoelectronic component includes providing an optoelectronic semiconductor chip having a first surface on which a first electrical contact and a second electrical contact are arranged; arranging a protection diode on the first contact and the second contact; galvanically growing a first pin on the first electrical contact and a second pin on the second electrical contact; and embedding the first pin, the second pin, and the protection diode in a molded body.