Optoelectronic Component Embedded Molded Body Thermal Management
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Solution Overview
Problem
Existing optoelectronic semiconductor components face challenges in compact design, efficient heat dissipation, and wide-angled emission of electromagnetic radiation, with limitations in thermal and mechanical stability and efficiency.
Innovation Solution
An optoelectronic component is created by embedding an optoelectronic semiconductor chip as a volume emitter into an optically transparent molded body with a soldering contact at the underside, where a bonding wire forms an electrically conductive connection embedded within the molded body, which can have a pyramidal-frustum-shaped section for improved light coupling and uses filling particles like amorphous SiO2 for enhanced thermal conductivity and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the optoelectronic semiconductor chip is embedded into the molded body with bonding wire inside, then the component achieves compact design and improved mechanical stability, but the production process becomes more complex
Solution Approach 1:
The bonding wire is arranged and electrically connected to the semiconductor chip before embedding into the molded body. This preliminary arrangement ensures stable electrical connections and mechanical support are established prior to encapsulation, achieving compact design and improved stability without requiring complex post-embedding modifications
Solution Approach 2:
The bonding wire is embedded within the molded body along with the semiconductor chip, creating a nested structure where the wire is enclosed within the transparent molded material. This integration achieves compact design and mechanical stability while the wire remains electrically functional
2Loss of energy
If the molded body is made optically transparent, then light emission efficiency is improved, but thermal conductivity and heat dissipation capability deteriorate
Solution Approach 1:
The molded body is made optically transparent in regions where light emission is required, while other regions or specific zones within the molded body may have different material properties optimized for thermal management. This localized differentiation allows simultaneous optimization of optical performance and thermal dissipation in different areas of the same component
3Stability of the object's composition
If the bonding wire is embedded into the molded body, then the component achieves compact design and improved mechanical integrity, but electrical connection reliability may be compromised
Solution Approach 1:
The bonding wire is arranged and electrically connected to the semiconductor chip before embedding into the molded body. This preliminary arrangement ensures stable electrical connections are established prior to encapsulation, and the connection structure is designed to maintain electrical conductivity while achieving mechanical integration within the molded body
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design results in a compact, efficient, and robust optoelectronic component with effective heat dissipation and wide-angled emission with low losses, maintaining high reflectivity and mechanical integrity.
Implementation Method 1
the optoelectronic semiconductor chip is embedded into an optically transparent molded body... electromagnetic radiation emitted by the volume emitter can advantageously pass through the optically transparent molded body of this optoelectronic component in different spatial directions
Implementation Method 2
uses filling particles like amorphous SiO2 for enhanced thermal conductivity and mechanical stability
Data Source
AI summary
An optoelectronic component includes an optoelectronic semiconductor chip embodied as a volume emitter, wherein the optoelectronic semiconductor chip is embedded into an optically transparent molded body, a soldering contact is arranged at an underside of the molded body, a bonding wire forms an electrically conductive connection between an electrical contact area of the optoelectronic semiconductor chip and the soldering contact, and the bonding wire is embedded into the molded body.