Optoelectronic Component Reflective Element for Color Homogeneity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optoelectronic components for compact devices like cellular phones and cameras face challenges in achieving high color homogeneity and compact size while maintaining efficient light emission.
Innovation Solution
The design includes a housing with a base section and a cover section, featuring an optoelectronic semiconductor chip and a reflective element with openings between the chip and an optical element, which directs and homogenizes light emission, allowing for compact dimensions and cost-effective production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the flashlight device is made compact with small structural height, then the device fits better in limited spatial dimensions, but achieving high color homogeneity becomes more difficult
Solution Approach 1:
The housing is segmented into a base section and a cover section that can be produced separately and then joined together. This segmentation allows for optimized individual manufacturing of each part while maintaining the overall compact structure and color homogeneity requirements.
Solution Approach 2:
The optoelectronic semiconductor chip is arranged within the housing structure on the base section, and the reflective element is integrated between the chip and the optical element in the cover section. This nested arrangement maximizes space utilization within the compact structural height while maintaining proper optical paths for color homogeneity.
2Ease of manufacture
If conventional housing production methods are used, then manufacturing is simpler, but achieving precise alignment between optical elements and semiconductor chip becomes difficult
Solution Approach 1:
The housing is divided into base section and cover section that can be manufactured independently using conventional methods, then joined together. This segmentation maintains ease of manufacture while allowing precise alignment features to be integrated at the joining interface.
Solution Approach 2:
The reflective element serves as an intermediary component arranged between the optoelectronic semiconductor chip and the optical element in the cover section. This intermediary structure facilitates precise alignment and optical coupling while maintaining manufacturing simplicity.
3Length of moving object
If the structural height is reduced for compact devices, then the device fits in smaller spaces, but light emission homogeneity deteriorates
Solution Approach 1:
The optical element is integrated into the cover section which is joined to the base section containing the semiconductor chip. This nested configuration allows the optical element to be positioned at an optimized distance from the chip, achieving homogeneous light emission within the reduced structural height.
Solution Approach 2:
The reflective element acts as an intermediary between the semiconductor chip and optical element, redirecting and homogenizing light emission. This intermediary structure ensures uniform light distribution is achieved despite the compact dimensional constraints.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures homogeneous light emission, enhances color mixing, and allows for compact external dimensions, making it suitable for small form factor devices while being cost-effective to produce.
Implementation Method 1
the reflective element may reflect part of the light emitted by the optoelectronic semiconductor chip within the interior of the housing of the optoelectronic component to achieve a homogeneous intermixing of the light
Implementation Method 2
The optical element of the optoelectronic component serves to direct light emitted by the optoelectronic semiconductor chip of the optoelectronic component into a target region to be illuminated
Data Source
AI summary
An optoelectronic component includes a housing including a base section and a cover section that delimit an interior of the housing, wherein an optoelectronic semiconductor chip is arranged on the base section, the cover section is formed by an optical element, and a reflective element including openings is arranged between the optoelectronic semiconductor chip and an outer side of the optical element.