Optoelectronic Connection Carrier with Insulating Strip

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Solution Overview

Problem

There is a need for a simplified and inexpensive method to produce a connection carrier for optoelectronic semiconductor components that can be effectively used for mechanical fastening, stabilization, and electrical contacting of electronic components.

Innovation Solution

A method involving a carrier plate with a planar top face, an electrically insulating insulation strip applied to the top face, and an electrically conductive conductor strip applied to the adhesive surface of the insulation strip, where the insulation strip cohesively connects both components, ensuring electrical insulation between the conductor strip and the carrier plate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If traditional methods are used to produce connection carriers, then manufacturing complexity and cost increase, but production simplicity and cost-effectiveness are needed

Engineering Contradiction:

Improveproduction simplicityVSAvoidmanufacturing complexity

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The connection carrier is divided into functionally independent strips (insulation strips and conductor strips) that are applied separately to the carrier plate. This segmentation allows each strip to be manufactured and applied independently, simplifying the overall manufacturing process while maintaining functional complexity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

An adhesive layer is introduced as an intermediary between the strips and the carrier plate, enabling simple adhesive bonding instead of complex mechanical or thermal attachment processes. This intermediary layer significantly simplifies the manufacturing steps required to secure the strips.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If traditional connection carrier structures are used, then production cost increases, but cost-effective production is required

Engineering Contradiction:

Improveproduction cost-effectivenessVSAvoidmaterial usage

Core Design Contradiction:

Ease of manufactureVSQuantity of substance

Solution Approach 1:

The insulation and conductor strips are implemented as thin, flexible adhesive strips that can be directly applied to the carrier plate. This eliminates the need for thick, rigid traditional connection structures, reducing material consumption while maintaining electrical and mechanical functionality.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The connection carrier uses composite structures combining insulating materials, conductive materials, and adhesive layers in a single integrated assembly. This composite approach allows all components to be applied together in sequence, reducing overall material usage compared to traditional multi-component assemblies.

Inventive Principle:

Principle #40Composite materials

3Productivity

If complex attachment methods are used, then manufacturing time increases, but quick production is needed

Engineering Contradiction:

Improveproduction speedVSAvoidmanufacturing time

Core Design Contradiction:

ProductivityVSLoss of time

Solution Approach 1:

The strips are prepared with adhesive surfaces in advance, allowing them to be directly applied to the carrier plate without requiring additional adhesive application steps during assembly. This preliminary preparation of adhesive surfaces significantly accelerates the manufacturing process.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Traditional mechanical attachment methods (screws, clips, or complex bonding processes) are replaced with simple adhesive bonding. This substitution eliminates time-consuming mechanical assembly steps while maintaining secure attachment of the strips to the carrier plate.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for the quick and cost-effective production of connection carriers that effectively support and electrically connect electronic components, enhancing the efficiency of optoelectronic semiconductor components by providing reliable mechanical and electrical interfaces.

Implementation Method 1

cohesively connecting the carrier plate and the insulation strip

Methodology Applied

Scientific EffectCohesive connection: Cohesion

Implementation Method 2

applying at least one electrically insulating insulation strip to the top face

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS10468569B2Method of producing a connection support, connection support and optoelectronic semiconductor component comprising a connection support

Publication Date: 2019.11.05 ALANOD GMBH

AI summary

A method of producing at least one connection carrier includes: A) providing a carrier plate with a planar top face; B) applying at least one electrically insulating insulation strip to the top face and cohesively connecting the carrier plate and the insulation strip; and C) applying at least one electrically conductive conductor strip to an adhesive surface of the insulation strip and cohesively connecting the insulation strip and the conductor strip, wherein the conductor strip and the carrier plate are electrically insulated from one another by the insulation strip.